Patents by Inventor Zhongtao Li

Zhongtao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11247200
    Abstract: The present invention provides a carbon nitride-based photocatalyst and a preparation method thereof. The photocatalyst is prepared by reaction of melem with 3,3?,4,4?-benzophenonetetracarboxylic dianhydride. The photocatalyst according to an embodiment of the present invention achieves energy level matching in structure between the melem structure and the 3,3?,4,4?-benzophenonetetracarboxylic dianhydride, reduces a singlet-triplet energy gap (?EST), promotes an intersystem crossing process, thereby enhancing the singlet oxygen production and improving the selective photocatalytic oxidation ability.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: February 15, 2022
    Assignee: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA)
    Inventors: Wenting Wu, Congcong Han, Mingbo Wu, Zhongtao Li, Qinggang Zhang
  • Publication number: 20200055036
    Abstract: The present invention provides a carbon nitride-based photocatalyst and a preparation method thereof. The photocatalyst is prepared by reaction of melem with 3,3?,4,4?-benzophenonetetracarboxylic dianhydride. The photocatalyst according to an embodiment of the present invention achieves energy level matching in structure between the melem structure and the 3,3?,4,4?-benzophenonetetracarboxylic dianhydride, reduces a singlet-triplet energy gap (?EST), promotes an intersystem crossing process, thereby enhancing the singlet oxygen production and improving the selective photocatalytic oxidation ability.
    Type: Application
    Filed: July 3, 2017
    Publication date: February 20, 2020
    Inventors: Wenting WU, Congcong HAN, Mingbo WU, Zhongtao LI, Qinggang ZHANG
  • Patent number: 7989030
    Abstract: A silicone resin containing boron, aluminum, and/or titanium, and having silicon-bonded branched alkoxy groups; a silicone composition containing a silicone resin; and a method of preparing a coated substrate comprising applying a silicone composition on a substrate to form a film and pyrolyzing the silicone resin of the film.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: August 2, 2011
    Assignee: Dow Corning Corporation
    Inventors: Ronald Boisvert, Duane Bujalski, Zhongtao Li, Kai Su
  • Publication number: 20090226609
    Abstract: A silicone resin containing boron, aluminum, and/or titanium, and having silicon-bonded branched alkoxy groups; a silicone composition containing a silicone resin; and a method of preparing a coated substrate comprising applying a silicone composition on a substrate to form a film and pyrolyzing the silicone resin of the film.
    Type: Application
    Filed: July 23, 2007
    Publication date: September 10, 2009
    Inventors: Ronald Boisvert, Duane Bujalski, Zhongtao Li, Kai Su
  • Patent number: 6737117
    Abstract: Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: May 18, 2004
    Assignee: Dow Corning Corporation
    Inventors: Ronald P. Boisvert, Duane R. Bujalski, Brian R. Harkness, Zhongtao Li, Kai Su, Bianxiao Zhong
  • Patent number: 6689859
    Abstract: A hydrosilylation reaction curable composition that includes a silsesquioxane polymer, a mixture of silanes or siloxanes as a cross-linking compound and a hydrosilylation reaction catalyst. The curable composition is cured to form a cured resin having high fracture toughness and strength without the loss of elastic modulus.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: February 10, 2004
    Assignee: Dow Corning Corporation
    Inventors: Zhongtao Li, Frederick J. McGarry, John R. Keryk, Bizhong Zhu, Dimitris E. Katsoulis
  • Patent number: 6646039
    Abstract: A hydrosilylation reaction curable composition including a silsesquioxane polymer, a cross-linking compound, a hydrosilylation reaction catalyst and colloidal silica having a surface coating formed thereon. The curable composition is cured to form a cured resin having high fracture toughness and strength without the loss of elastic modulus and glass transition temperature.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: November 11, 2003
    Assignee: Dow Corning Corporation
    Inventors: Zhongtao Li, Frederick J. McGarry, Dimitris E. Katsoulis, John R. Keryk, Debora F. Bergstrom, Kermit S. Kwan, Bizhong Zhu
  • Publication number: 20030191267
    Abstract: Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2.
    Type: Application
    Filed: April 5, 2002
    Publication date: October 9, 2003
    Inventors: Ronald P. Boisvert, Duane R. Bujalski, Brian R. Harkness, Zhongtao Li, Kai Su, Bianxiao Zhong
  • Publication number: 20030171486
    Abstract: A hydrosilylation reaction curable composition that includes a silsesquioxane polymer, a mixture of silanes or siloxanes as a cross-linking compound and a hydrosilylation reaction catalyst. The curable composition is cured to form a cured resin having high fracture toughness and strength without the loss of elastic modulus.
    Type: Application
    Filed: March 5, 2002
    Publication date: September 11, 2003
    Inventors: Zhongtao Li, Frederick J. McGarry, John R. Keryk, Bizhong Zhu, Dimitris E. Katsoulis
  • Publication number: 20030171476
    Abstract: A hydrosilylation reaction curable composition including a silsesquioxane polymer, a cross-linking compound, a hydrosilylation reaction catalyst and colloidal silica having a surface coating formed thereon. The curable composition is cured to form a cured resin having high fracture toughness and strength without the loss of elastic modulus and glass transition temperature.
    Type: Application
    Filed: March 5, 2002
    Publication date: September 11, 2003
    Inventors: Zhongtao Li, Frederick J. McGarry, Dimitris E. Katsoulis, John R. Keryk, Debora F. Bergstrom, Kermit S. Kwan, Bizhong Zhu
  • Publication number: 20030148019
    Abstract: A colloid composition can be used to form a thin film on a substrate. The colloid can be colloidal silica. The thin film can be a dielectric layer. The substrate can be a semiconductor substrate having gaps thereon.
    Type: Application
    Filed: November 19, 2001
    Publication date: August 7, 2003
    Inventors: Byung Keun Hwang, Kermit Shannon Kwan, Zhongtao Li, Eric Scott Moyer, Sheng Wang, David Lee Wyman, Xiaobing Zhou
  • Patent number: 6596821
    Abstract: A process for producing a cured silsesquioxane resin. The process includes fractionating the silsesquioxane resin a plurality of times utilizing an organic solvent in combination with an organic non-solvent. The fractionated resin is then stripped of excess solvent. The stripped resin is then mixed with a cross-linking compound to form a curable composition. The curable composition is cured to form a cured resin having high fracture toughness and strength without the loss of elastic modulus.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: July 22, 2003
    Assignee: Dow Corning Corporation
    Inventors: Dimitris E. Katsoulis, Bizhong Zhu, John R. Keryk, Frederick J. McGarry, Zhongtao Li
  • Patent number: 6310146
    Abstract: A cured silsesquioxane resin and method for its preparation are disclosed. By using a silyl-terminated hydrocarbon in the hydrosilylation reaction curable composition used to prepare the cured silsesquioxane resin, the cured silsesquioxane resin has improved strength and toughness without significant loss of modulus. A typical silyl-terminated hydrocarbon useful in this invention is silphenylene.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: October 30, 2001
    Assignees: Dow Corning Corporation, Massachusetts Institute of Technology
    Inventors: Dimitris Elias Katsoulis, Zhongtao Li, Frederick Jerome McGarry, Bihn Thanh Nguyen, Bizhong Zhu