Patents by Inventor Zhongwang LIU

Zhongwang LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038837
    Abstract: A super junction MOSFET device, including: a substrate having a first conductive type; a buffer layer having the first conductive type and disposed on the substrate; a super junction structure disposed on the buffer layer and including multiple first conductive type pillars and multiple second conductive type pillars alternately arranged in a transverse direction, several second conductive type pillars being partially and/or wholly displaced to provide two or more different transverse dimensions for the first conductive type pillars; a body region having the second conductive type and disposed on a top of the second conductive type pillar; a source structure located within the body region and including a source region having the first conductive type and an ohmic contact region having the second conductive type which contacts with the source region; and a gate structure in contact with the first conductive type pillar and the source structure.
    Type: Application
    Filed: March 16, 2022
    Publication date: February 1, 2024
    Applicant: CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO., LTD
    Inventors: Tian LIAO, Rongyao MA, Daili WANG, Pengcheng ZHANG, Jing LENG, Zhongwang LIU