Abstract: An anti-fibrosis pharmaceutical composition and application thereof. The anti-fibrosis pharmaceutical composition specifically comprises: (a) an NRP1 inhibitor and/or an HIF2? inhibitor; and (b) an EPCR pathway activator that promotes the activity of an EPCR pathway. The anti-fibrosis pharmaceutical composition helps reduce organ fibrosis to a certain extent and promotes corresponding organ repair and regeneration.

Abstract: This disclosure relates to a thermal conductive silicone composition. The composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule and having a viscosity at 25° C. of from 10 to 10,000 mPa·s measured using a type B viscometer according to ASTM D 1084, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, (C) a specific adhesion promoter, (D) at least one thermal conductive filler, (E) at least one filler treating agent, and (F) a hydrosilylation reaction catalyst, with the proviso that the composition does not contain a condensation catalyst. The composition exhibits good self-adhesive properties to various substrates even when it is cured at a relatively low temperature, without impairing its flowability.

Abstract: A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.

Abstract: A composition contains: (a) a vinyl-functional polysiloxane; (b) a silyl hydride functional polysiloxane having on average at least two silyl hydride groups per molecule; (c) 60 to 92 weight-percent thermally conductive filler; (d) a platinum hydrosilylation catalyst; and (e) 0.05 to 2.0 weight-percent of a trialkoxy-functional polysiloxane; where the trialkoxy-functional polysiloxane has two or more trialkoxy functionalities per molecule and a number average molecular weight of 1200 or more and where weight-percents are relative to the composition weight.

Abstract: A composition contains (a) a polysiloxane; and (b) 0.15 weight-percent or more and 85 weight-percent of less, relative to composition weight dispersed in the polysiloxane, of zinc oxide particles having an average particle size of less than one micrometer and greater than one nanometer as determined as the volume weighted median value of particle diameter distribution using a laser diffraction particle size analyzer.

Abstract: A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.

Abstract: A composition comprising: (A) an organopolysiloxane, (B) a filler and (C) a filler treatment agent, comprising a mixture of two organopolysiloxanes having the general formulas (I) and (II), R1R2R3Si—[(CH2)n1(Me2SiO)m1]r—[O-(Me2SiO)m3]p-(Me2Si)o(CH2)n2(Me2SiO)m2—(CH2)n3—Si(OR43)3 (I), wherein ‘Me’ is methyl group, R1, R2 and R3 are independently selected from an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 4 carbon atoms, an alkoxy group having 1 to 3 carbon atoms or —(OSiR7R8R9), in which R7, R8 and R9 are independently selected from an alkyl group having 1 to 4 carbon atoms, R4 is an alkyl group having 1 to 4 carbon atoms, n1, n2, m1, m3 and o are integers from 1 to 200, m2, n3, r and p are integers from 0 to 200, r and p are not 0 at the same time, (R5O)3Si—[(CH2)n1(Me2SiO)m1]r—(CH2)n4—[O-(Me2SiO)m3]p-(Me2Si)o-(CH2)n2-(Me02SiO)m2—(CH2)n3—Si(OR6)3 (II), wherein R5 and R6 are an alkyl group having 1 to 4 carbon atoms, n1, m1, m3, o and n2 are integers from 1 to 200, n3, n4, m2, r and

Abstract: A composition comprising: (A) an organopolysiloxane, (B) a filler and (C) a filler treatment agent, comprising a mixture of two organopolysiloxanes having the general formulas (I) and (II), R1R2R3Si—[ (CH2)m1 (Me2SiO)m1]r—[O-(Me2SiO)m3]p-(Me2Si)0 (CH2)m2 (Me2SiO)m2—(CH2)m3—Si (OR43)3 (I), wherein ‘Me’ is methyl group, R1, R2 and R3 are independently selected from an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 4 carbon atoms, an alkoxy group having 1 to 3 carbon atoms or (OSiR7R8R9), in which R7, R8 and R9 are independently selected from an alkyl group having 1 to 4 carbon atoms, R4 is an alkyl group having 1 to 4 carbon atoms, n1, n2, m1, m3 and o are integers from 1 to 200, m2, n3, r and p are integers from 0 to 200, r and p are not 0 at the same time, (R5O)3Si—[(CH2)n1(Me2SiO)m1]r—(CH2)n4—[O-(Me2SiO)m3]p-(Me2Si)o-(CH2)m2— (Me2SiO)m2—(CH2)n3—Si(OR6)3 (II), wherein R5 and R6 are an alkyl group having 1 to 4 carbon atoms, n1, m1, m3, o and n2 are integers from 1 to 200, n3, n4, m2, r

Abstract: A dual key bi-step lock having a shell and a cylindrical plug in the shell. The plug has a primary keyway and a secondary keyway and at least one set of primary pin stack and at least one set of secondary pin stack between the shell and the plug, respectively coupling with the primary and the secondary keys. a longitudinal stage is formed on a cylindrical surface of the plug. An involute side face extending from the stage to the cylindrical surface of the plug. The primary key is able to dive the plug to a position of first step open at which the stage is stopped by the key pin of the secondary pin stack. The secondary pin stack is unlocked by the secondary key and the plug is able to be further driven to a position of second step open by the primary and the secondary keys from the first step open.

Abstract: A combination padlock with revolving cover having a baseplate having an upper side, a lower side, a front side, a keypad on the front side, and a pillar formed on the front side. A revolving cover of a basically same contour as the baseplate has a rear face contacting the front side of the baseplate, a front face, a round opening, and an arc groove defined in the rear face thereof. A central cap has a side wall received in the round opening of the revolving cover and fixed to the baseplate, and a peripheral covering and resting on the front face of the revolving cover.

Abstract: A door locking system with an idle handle has a door panel having a front face, a rear face, a hinged side, a free side, an upper side, a lower side, and an electronic lock and a mechanical lock installed in the door panel respectively having a keypad and a keyhole on the front face. The system further has a level toggler, at least one bolt, a chamber defined therein, a handle seat, a handle lever, a latch lever, a linking arm, a swivel pillar, a paddle shifter, an upright toggler, and an handle lever resume spring.

Abstract: A door locking system with an idle handle has a door panel having a front face, a rear face, a hinged side, a free side, an upper side, a lower side, and an electronic lock and a mechanical lock installed in the door panel respectively having a keypad and a keyhole on the front face. The system further has a level toggler, at least one bolt, a chamber defined therein, a handle seat, a handle lever, a latch lever, a linking arm, a swivel pillar, a paddle shifter, an upright toggler, and an handle lever resume spring.

Abstract: A dual key bi-step lock having a shell and a cylindrical plug in the shell. The plug has a primary keyway and a secondary keyway and at least one set of primary pin stack and at least one set of secondary pin stack between the shell and the plug, respectively coupling with the primary and the secondary keys. a longitudinal stage is formed on a cylindrical surface of the plug. An involute side face extending from the stage to the cylindrical surface of the plug. The primary key is able to dive the plug to a position of first step open at which the stage is stopped by the key pin of the secondary pin stack. The secondary pin stack is unlocked by the secondary key and the plug is able to be further driven to a position of second step open by the primary and the secondary keys from the first step open.

Abstract: An emergently openable safe door having a mechanic lock and an electronic lock. The mechanic lock has a shell and a cylindrical plug in the shell. The plug has a primary keyway for a primary key and an emergent keyway for an emergent key. The mechanic lock and an electric lock are able to respectively be opened with a primary key and enter cod normally and be opened with the primary key and a emergent key emergently when the electronic lock thereof malfunctions or an enter code thereof is forgotten.