Abstract: A conductive terminal includes a conductive base substrate and a plating layer structure plated on the conductive base substrate. The plating layer structure includes a nickel plating layer located outside the conductive base substrate, a silver plating layer located outside the nickel plating layer, and a platinum-based polymetallic plating layer located outside the silver plating layer.

Abstract: An injection mold insert includes a first metal structure and a second metal structure. The first metal structure has a first hardness and a first thermal conductivity. The second metal structure is wrapped in the first metal structure and has a second hardness less than that of the first hardness, and a second thermal conductivity higher than the first thermal conductivity. The first metal structure and the second metal structure are sintered together without layering or infiltration.

Abstract: An injection mold insert includes a housing of a first material and an inner core of a second material sealed in the housing of the first material. A mechanical strength of the first material is greater than that of the second material. The thermal conductivity of the second material is greater than that of the first material. The inner core is formed by filling a molten liquid of the second material into an inner cavity of the housing.

Abstract: A workpiece plating treatment method includes the steps of cleaning an outer surface of an outer plating layer of a workpiece to remove a plurality of oxides and dirt on the outer surface of the outer plating layer, and reflow melting the outer plating layer of the workpiece using a reflow melting device after the cleaning.

Abstract: A workpiece plating treatment method includes the steps of providing a pulse laser having a plurality of different energy levels, adjusting the pulse laser to the plurality of different energy levels, and scanning a plating layer of a workpiece with the pulse laser at the plurality of different energy levels to effect different changes on the plating layer. The different energy levels include an activation energy level, a temperature rise energy level, a constant temperature energy level, a melting energy level, a cooling energy level, and a polishing energy level.

Abstract: An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.

Abstract: An air nozzle includes a main body having a compressed air passageway to allow a compressed air to flow therethrough and a compensation air passageway in communication with the compressed air passageway. An external air is sucked into the compressed air passageway through the compensation air passageway and ejected together with the compressed air when the compressed air flows through the compressed air passageway.

Abstract: A foamable cross-linkable thermoplastic material comprises a matrix polymer of any one or a mixture of two or more of polyethylene (PE), ethylene vinyl acetate copolymer (EVA) and polypropylene (PP), a cross-linking agent, and a foaming agent. A weight ratio of the cross-linking agent to the matrix polymer is 1-5:100. A weight ratio of the foaming agent to the matrix polymer is 1-5:100. A cross-linking foaming temperature of the thermoplastic material is equal to or higher than the melting point of the matrix polymer.

Abstract: A filter element includes a stirring device, a continuous adsorption carrier arranged around the stirring device, and a granular adsorption carrier filled between the continuous adsorption carrier and the stirring device. The stirring device stirs the granular adsorption carrier when filtering a liquid with the filter element.

Abstract: An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.

Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

Abstract: A reflow melting system for reflow melting a metal coating on an electrical contact area of a terminal includes a laser head for emitting a laser light onto the metal coating on the terminal to heat and melt the metal coating. A remote control terminal is provided in communication with the laser head for adjusting at least one working parameter of the laser head for optimizing the melting effect of the metal coating.

Abstract: An air nozzle includes a main body having a compressed air passageway to allow a compressed air to flow therethrough and a compensation air passageway in communication with the compressed air passageway. An external air is sucked into the compressed air passageway through the compensation air passageway and ejected together with the compressed air when the compressed air flows through the compressed air passageway.

Abstract: An electrophoretic coating is disclosed. The electrophoretic coating comprises an aqueous medium and a charged film-forming resin dispersed in the aqueous medium. The film-forming resin is acid-insoluble and alkali-soluble.

Abstract: A silicon oil sensor has a conductive layer made of an organic silicone polymer doped with conductive particles.

Abstract: A cooling system of an injection mold comprises an air cooling pathway formed in a mold core and having an inlet and an outlet, a vortex tube having a cold air output port, a hot air output port, and a compressed air input port, and a compressed air supply device in communication with the compressed air input port and configured to supply a compressed air to the vortex tube. The vortex tube separates the compressed air into a cold air with a temperature lower than that of the compressed air and a hot air with a temperature higher than that of the compressed air. The cold air is output from the cold air output port. The hot air is output from the hot air output port. The cold air output port communicates with the inlet and supplies the cold air into the air cooling pathway to cool the mold core.

Abstract: An electrophoretic coating is disclosed. The electrophoretic coating comprises an aqueous medium and a charged film-forming resin dispersed in the aqueous medium. The film-forming resin is acid-insoluble and alkali-soluble.

Abstract: A method and apparatus for quantifying an activity of a chemical plating solution in a chemical plating system is disclosed. The method comprises performing an electrochemical impedance spectrum (EIS) measurement on one or more chemical plating solutions in the chemical plating system, processing data for each EIS measurement result to obtain a corresponding charge transfer resistance value, obtaining a correspondence between the activity and the charge transfer resistance value in each chemical plating solution, and quantifying the activity of each chemical plating solution in the chemical plating system using the correspondence to the charge transfer resistance value.

Abstract: A silicon oil sensor is provided and includes a transparent member and a laser source emitting a laser beam. The transparent member includes a light receiving passageway with an oil receiving section and a side surface. The laser beam is directed into the light receiving passageway such that an incident angle ? of the laser beam (L) with respect to the side surface is selected so that a total reflection of the laser beam (L) occurs on the side surface when the oil receiving section is filled with air and exits out of the transparent member along a total reflection path (L1). A refraction of the laser beam (L) occurs along a refraction path (L2) when the oil receiving section collects silicon oil.

Abstract: A silicon oil sensor is provided and includes a transparent member and a laser source emitting a laser beam. The transparent member includes a light receiving passageway with an oil receiving section and a side surface. The laser beam is directed into the light receiving passageway such that an incident angle ? of the laser beam (L) with respect to the side surface is selected so that a total reflection of the laser beam (L) occurs on the side surface when the oil receiving section is filled with air and exits out of the transparent member along a total reflection path (L1). A refraction of the laser beam (L) occurs along a refraction path (L2) when the oil receiving section collects silicon oil.