Patents by Inventor Zhongyu LUAN

Zhongyu LUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
    Publication number: 20180009141
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Application
    Filed: August 16, 2017
    Publication date: January 11, 2018
    Inventors: Mingzhu WANG, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
  • Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
    Publication number: 20180007244
    Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
    Type: Application
    Filed: March 29, 2017
    Publication date: January 4, 2018
    Inventors: Mingzhu WANG, Zhenyu CHEN, Takehiko TANAKA, Zhongyu LUAN, Bojie ZHAO, Zhen HUANG, Nan GUO, Fengsheng XI, Heng JIANG, Zilong DENG
  • Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
    Patent number: 9826132
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: November 21, 2017
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
  • Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
    Patent number: 9781325
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: October 3, 2017
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
  • Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
    Publication number: 20170264802
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 14, 2017
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING
  • Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
    Publication number: 20170264803
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 14, 2017
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING
  • Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
    Publication number: 20170264801
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Application
    Filed: March 29, 2017
    Publication date: September 14, 2017
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING
  • Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
    Publication number: 20170264804
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 14, 2017
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING