Abstract: Semiconductor devices including one or more interfacing segments patterned within an outer protective layer and associated systems and methods are disclosed herein. The one or more interfacing segments may provide attachment interfaces/surfaces for connection pads. The one or more interfacing segments or a portion thereof may remain uncovered or exposed and provide warpage control for the corresponding semiconductor device.

Abstract: Compounds and pharmaceutical compositions that modulate kinase activity, including mutant EGFR and mutant HER2 kinase activity, and compounds, pharmaceutical compositions, and methods of treatment of diseases and conditions associated with kinase activity, including mutant EGFR and mutant HER2 activity, are described herein.

Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: The present application a model changing method and a battery tray. The model changing method includes: limiting a limited member by a pair of limiting assemblies, where each of the limiting assemblies is provided with a first limiting surface and a second limiting surface; disposing two first limiting surfaces of the pair of limiting assemblies opposite each other to form a first accommodating cavity; and disposing two second limiting surfaces of the pair of limiting assemblies opposite each other to form a second accommodating cavity, where a length of the first accommodating cavity is not equal to that of the second accommodating cavity.

Abstract: The present invention relates to the cross field of smart grid and artificial intelligence, provides a non-intrusive load monitoring method and device based on physics-informed neural network, comprising the following steps: Step 1, obtaining a total load data and an equipment load data of a building in a certain period of time, and using a sliding window method to cut to construct a training data. Step 2, designing a deep learning neural network model to learn the equipment load characteristics contained in the total load data, and outputting the equipment load forecasting. Step 3, based on a physics-constrained learning framework, training the deep learning neural network model by iteratively optimizing the training loss to obtain a trained physics-informed neural network model. Step 4, monitoring the equipment's power consumption in the building according to the output results of the physics-informed neural network model.

Abstract: A semiconductor device includes an analog voltage regulator and an integrated circuit module. The analog voltage regulator generates a regulated output voltage. The integrated circuit module generates an analog sense voltage based on the regulated output voltage and includes integrated circuit dies, a first sensor, second sensors, and a digital voltage offset controller (DVOC). The first sensor generates a digital reference voltage based on an analog reference voltage. The second voltage sensors detect voltages at predetermined locations on the integrated circuit dies. The DVOC generates a digital offset voltage substantially equal to the difference between the digital reference voltage and the voltage detected by a selected one of the second voltage sensors. The regulated output voltage is based on an unregulated input voltage, the analog sense voltage, and the digital offset voltage.

Abstract: The present application relates to a spectral restoring method, including: acquiring a light energy response signal matrix output by a photosensitive chip of a spectral imaging device and a standard spectrum; determining a primitive restoring function and a response signal vector of the primitive restoring function based on the light energy response signal matrix, the primitive restoring function restoring a spectral image value of a predetermined channel corresponding thereto using a predetermined pixel value of the photosensitive chip and pixel values in the vicinity thereof; acquiring a restoring tensor, the product of the restoring tensor and the response signal vector being equal to an output of the primitive restoring function based on the response signal vector; and obtaining a restored spectral image based on the product of the restoring tensor and the response signal vector.

Abstract: The application discloses a method adapted to manufacture an array substrate and a display panel. The method includes: forming a photoresist layer, a source and a drain; post-baking the photoresist layer, so that the photoresist layer flows to the position of a channel; etching a semiconductor layer to obtain a preset pattern; and peeling off the photoresist layer.

Abstract: The current document is directed to methods and subsystems that manage submitted code changes for processing by continuous-integration/continuous-delivery/deployment systems. In disclosed implementations, code changes are processed as quickly as possible, when the code changes are flagged as being urgent. Non-urgent code changes are evaluated for the possibility of merging the non-urgent code changes with additional, subsequently submitted code changes in order to more efficiently employ computational resources needed for processing the code changes. When there is a code change, waiting for processing, with which a submitted code change can be merged, the submitted code change is merged with the waiting code change so that the merged code changes can be together verified.

Abstract: A semiconductor device and method of manufacturing that includes a first etch stop layer and a second etch stop layer to prevent delamination and damage to underlying components. A first passivation layer and a second passivation layer are disposed on a substrate, with a metal pad exposed through the passivation layers and contacting a top metal component of the substrate. The first etch stop layer is then formed on the second passivation layer and the metal pad. A third passivation layer is then formed on the substrate with an opening to the metal pad, which is covered by the first etch stop layer. The second etch stop layer is then formed on the third passivation layer and in the opening on the second etch stop layer. A bottom metal film/conductive component is then formed on the second etch stop layer, photoresist is applied, and wet etching is performed. The metal pad is protected from damage caused by delamination of the second etch stop layer by the first etch stop layer.

Abstract: This application discloses an array substrate and a display panel. The array substrate includes a first metal layer and a second metal layer, and an area of a region overlapping the second metal layer on the first metal layer is less than that of a region not overlapping the second metal layer on the first metal layer.

Abstract: The present application discloses a display panel and a display device. In each set of transmission signal lines, the line width of a transmission signal line correspondingly connected to a clock signal line close to the display area is smaller than that of a transmission signal line correspondingly connected to a clock signal line away from the display area.

Abstract: A method is provided for a hyper-converged storage-compute system to implement an active-active failover architecture for providing Internet Small Computer System Interface (iSCSI) target service. The method intelligently selects multiple hosts to become storage nodes that process iSCSI input/output (I/O) for a target. The method further enables iSCSI persistent reservation (PR) to handle iSCSI I/Os from multiple initiators.

Abstract: The application discloses a method adapted to manufacture an array substrate and a display panel. The method includes: forming a photoresist layer, a source and a drain; post-baking the photoresist layer, so that the photoresist layer flows to the position of a channel; etching a semiconductor layer to obtain a preset pattern; and peeling off the photoresist layer.

Abstract: An adaptive idle detection method determines whether software defined data centers (SDDCs) in a hyperconverged infrastructure (HCI) environment are idle. Idleness may be quantified via a coefficient of variation (CV) against resource usage, so as to adapt the idle detection method to SDDCs with different hardware specifications and workloads. Management overhead may also be filtered out by the idle detection method, and the idle detection method may use idleness scores to further reduce overhead.

Abstract: the present application provides a display panel and manufacturing method thereof, the display panel includes: a substrate, which comprises a first substrate and a second substrate arranged oppositely; a black matrix layer, formed on the first substrate; an alignment layer, formed on the black matrix layer and the second substrate; a color filter layer, formed on the first substrate or the second substrate; a liquid crystal layer, formed between the first substrate and the second substrate; and an active switch, formed on the substrate; where at least one groove is formed on the black matrix layer, a shading layer is formed on the position of the substrate corresponding to the groove, and the area of the substrate in which the groove is orthogonally projected is fully covered by the area of the substrate in which the shading layer is orthogonally projected.

Abstract: The present application discloses a testing device of array substrates and a testing method. The testing device of array substrates includes: a machine and testing interfaces, the testing interfaces being disposed on the machine; and testers disposed above the machine. There are at least two sets of testers, and the testers synchronously operate according to a preset scheme.

Abstract: The present application discloses a cleaning method and a cleaning device. The cleaning method includes the following steps: dividing a cleaning device into at least two regions to control for the same cleaning mode; detecting a width of an object to be cleaned; and turning on the cleaning device of corresponding region according to the width of the object to be cleaned. The cleaning device includes a detection structure, a conveying structure, a washing structure, an air knife structure, and a control structure, where the washing structure is divided into at least two regions, and the air knife structure is also divided into at least two regions.

Abstract: This application discloses a display panel and a display apparatus. The display panel includes a common electrode cable, an active switch, and a signal cable. The signal cable is overlapped with the active switch to form a first overlapping region, and a first extension cable and a second extension cable of the common electrode cable are connected to the signal cable to form a second overlapping region and a third overlapping region.

Abstract: The present application discloses a testing device of array substrates and a testing method. The testing device of array substrates includes: a machine and testing interfaces, the testing interfaces being disposed on the machine; and testers disposed above the machine. There are at least two sets of testers, and the testers synchronously operate according to a preset scheme.