Patents by Inventor Zhou Ming

Zhou Ming has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110291254
    Abstract: Embodiments of the present invention relate to semiconductor device packages featuring encapsulated leadframes in electrical communication with at least one die through electrically conducting bumps or balls and electrically conducting ribbons. Embodiments of the present invention may permit multiple die and/or multiple passive devices to occupy space in the package previously consumed by the diepad. The result is a flexible packaging process allowing the combination of die and technologies required for complete sub-systems in a conventional small JEDEC specified footprint.
    Type: Application
    Filed: August 9, 2011
    Publication date: December 1, 2011
    Applicant: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Teng Hui, Hongbo Yang, Zhou Ming, Anthony C. Tsui
  • Publication number: 20080135991
    Abstract: Embodiments of the present invention relate to semiconductor device packages featuring encapsulated leadframes in electrical communication with a supported die through electrically conducting bumps or balls. By eliminating the need for a separate diepad and lateral isolation between an edge of the diepad and adjacent non-integral leads or pins, embodiments of packages fabricated by bump on leadframe (BOL) processes in accordance with embodiments of the present invention increase the space available to the die for a given package footprint. Embodiments of the present invention may also permit multiple die and/or multiple passive devices to occupy space in the package previously consumed by the diepad. The result is a flexible packaging process allowing the combination of die and technologies required for complete sub-systems in a conventional small JEDEC specified footprint.
    Type: Application
    Filed: December 12, 2006
    Publication date: June 12, 2008
    Applicant: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Teng Hui, Hongbo Yang, Zhou Ming, Anthony C. Tsui
  • Publication number: 20080126076
    Abstract: A set of candidate documents, each of which may be part of a bilingual, parallel set of documents, are identified. The set of documents illustratively includes textual material in a source language. It is then determined whether parallel text can be identified. For each document in the set of documents, it is first determined whether the parallel text resides within the document itself. If not, the document is examined for links to other documents, and those linked documents are examined for bilingual parallelism with the selected documents. If not, named entities are extracted from the document and translated into the target language. The translations are used to query search engines to retrieve the parallel correspondent for the selected documents.
    Type: Application
    Filed: August 7, 2006
    Publication date: May 29, 2008
    Applicant: Microsoft Corporation
    Inventors: Zhou Ming, Niu Cheng