Patents by Inventor Zhou Zhou
Zhou Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240175587Abstract: A beehive indoor-air alternate-working dehumidification system includes a fresh air dehumidification sterilization system. The fresh air dehumidification sterilization system includes a fan, a filter, a dehumidification apparatus, a moisture absorbing material, a plasma generator, a temperature and humidity sensor, a heater, and a three-way valve. A hexagonal prism beehive structure is used in a dehumidification apparatus, and a novel moisture absorbing material with high moisture absorption and high temperature sensitivity is used to dehumidify fresh air, to improve a dehumidification capacity and reduce dehumidification energy consumption. The plasma generator generates ions to sterilize and deodorize fresh air. The temperature and humidity sensor detects humidity of fresh air, determines whether the material needs desorption. The heater heats return air to enable the return air to desorb a saturated moisture absorbing material.Type: ApplicationFiled: July 25, 2023Publication date: May 30, 2024Inventors: Zilong Zhong, Jie Liu, Yu Wang, Jinlin Liu, Zhou Zhou, Shuaixing Mai
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Patent number: 11995337Abstract: Methods, systems, and devices for improved implicit ordered command handling are described. For instance, a memory device may receive, from a host device, a first command and a second command. The memory device may determine whether a first memory operation associated with the first command and a second memory operation associated with the second command are to be performed in an order relative to each other based on a first time when the first command is received relative to a second time when the second command is received. The memory device may select whether to perform a first memory access procedure or a second memory access procedure based on whether the first memory operation and the second memory operation are a same type of memory operation and on whether the first memory operation and the second memory operation are to be performed in the order relative to each other.Type: GrantFiled: February 18, 2021Date of Patent: May 28, 2024Assignee: Micron Technology, Inc.Inventors: Huachen Li, Zhou Zhou, Chaofeng Zhang, Jianfeng Li, Chen Huang, Lin Huang, Wei Li
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Patent number: 11995381Abstract: Computing devices, computer-readable storage media, and computer-implemented methods are disclosed for prediction of capacity. In a central tier, central-tier benchmark values are generated from benchmark testing performed on different test configurations in a reference execution environment. In a deployment tier, deployment-tier benchmark values are generated from benchmark testing performed on a baseline deployed configuration in many execution environments. A sizing model is learned from the central-tier benchmark values to predict execution platform requirements given a set of workload input parameters. A performance model is learned from the deployment-tier and the central-tier benchmark values to predict a performance delta value reflecting relative performance between a particular execution environment and the reference execution environment. The performance delta value is used to adjust predicted execution platform requirements to tailor the prediction to a particular execution environment.Type: GrantFiled: June 27, 2019Date of Patent: May 28, 2024Assignee: Splunk Inc.Inventors: Jie Cai, Yang Cao, Ning He, Bing Pei, Xiaolu Ye, Chong Yu, Aiping Zhang, Zhou Zhou
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Patent number: 11991581Abstract: A system and method of a base station are configured to enable a multi-shot network parameter optimization. The method includes generating one or more specified Key Performance Indicators (KPI) constraints based on a selected set of KPIs. The method also includes adjusting common beam parameters to tune a common beam based on the selected set of KPIs. The common beam is tuned to satisfy the one or more specified KPI constraints. The method also includes adjusting handover A2 and A5 parameters based on searching within a three-dimensional space defined by specified A2 and A5 thresholds. The method further includes transmitting one or more signals based on the adjusted the common beam parameters and the adjusted handover A2 and A5 parameters.Type: GrantFiled: July 23, 2021Date of Patent: May 21, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Hao Chen, Lianjun Li, Zhou Zhou, Yan Xin, Jianzhong Zhang
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Publication number: 20240103052Abstract: The present invention relates to the cross field of smart grid and artificial intelligence, provides a non-intrusive load monitoring method and device based on physics-informed neural network, comprising the following steps: Step 1, obtaining a total load data and an equipment load data of a building in a certain period of time, and using a sliding window method to cut to construct a training data. Step 2, designing a deep learning neural network model to learn the equipment load characteristics contained in the total load data, and outputting the equipment load forecasting. Step 3, based on a physics-constrained learning framework, training the deep learning neural network model by iteratively optimizing the training loss to obtain a trained physics-informed neural network model. Step 4, monitoring the equipment's power consumption in the building according to the output results of the physics-informed neural network model.Type: ApplicationFiled: January 14, 2023Publication date: March 28, 2024Inventors: GANG HUANG, WEI HUA, ZHOU ZHOU
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Publication number: 20240096769Abstract: The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Applicant: NEXPERIA B.V.Inventors: Haibo Fan, Zhou Zhou, Chi Ho Leung
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Publication number: 20240089155Abstract: A first device may transmit a first symbol for a second device and a second symbol for a third device. The first device may generate a first dictionary and a second dictionary that satisfy a complementary rule. The first device may modulate the first symbol onto an entry from the first dictionary to produce first modulated data and may modulate the second symbol onto an entry from the second dictionary to produce second modulated data. The first device may generate a third symbol as a joint modulation of the first and second modulated data and may transmit the third symbol using a resource element. The second device may decode the third symbol based on the first dictionary to recover the first symbol. The third device may decode the third symbol based on the second dictionary to recover the second symbol. Privacy may be maintained between the second and third devices.Type: ApplicationFiled: September 14, 2022Publication date: March 14, 2024Inventors: Zhou Zhou, Sharad Sambhwani
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Publication number: 20240078022Abstract: Methods, systems, and devices for memory system logical unit number (LUN) procedures are described. A memory system may receive an indication to convert a LUN for storing LBAs associated with an application from a first type to a second type, where the second type is associated with a higher performance defragmentation process than the first type. The memory system may perform defragmentation on data associated with the LUN based on converting the LUN to the second type. The memory system may determine whether the LBAs stored in the LUN are ordered based on the defragmentation, and the memory system may operate (e.g., execute) the application based on the LBAs being ordered.Type: ApplicationFiled: September 6, 2022Publication date: March 7, 2024Inventors: Zhou Zhou, Li Xin Zhao, Yanhua Bi
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Publication number: 20230402351Abstract: According to the disclosure a semiconductor package assembly is proposed, at least including: a lead metallic frame; a semiconductor die structure being mounted on a die pad of the lead metallic frame; at least a first bond clip connected with the semiconductor die structure; at least a further bond clip connected with the die pad of the lead metallic frame via a solder junction; and the die pad is provided with at least one recess near the connection with the at least further bond clip for accommodating solder for the solder junction. The disclosure also pertains to a method for manufacturing such a semiconductor package assembly.Type: ApplicationFiled: June 6, 2023Publication date: December 14, 2023Applicant: NEXPERIA B.V.Inventors: Ricardo Yandoc, Matthew Anthony, Zhou Zhou, Adam Brown
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Publication number: 20230380737Abstract: Provided is a blood collection tube sorting and centrifugal balancing device including a body frame. A vacuum blood collection tube mechanism, a centrifugal balancing tube mechanism, a sorting mechanism, a scanning identification mechanism, a test tube transporting mechanism, and a collection box are arranged on the body frame. The vacuum blood collection tube mechanism and the centrifugal balancing tube mechanism are parallelly arranged on an upper part of the body frame. The scanning identification mechanism is connected to the vacuum blood collection tube mechanism. The sorting mechanism is connected to the vacuum blood collection tube mechanism and the centrifugal balancing tube mechanism at two ends of the sorting mechanism, respectively. The test tube transporting mechanism is connected to the centrifugal balancing tube mechanism. The collection box is disposed in a middle part of the body frame and located directly below the vacuum blood collection tube mechanism.Type: ApplicationFiled: May 31, 2023Publication date: November 30, 2023Inventors: Jinxing YU, Yang ZHANG, Kai CUI, Zhou ZHOU, Yahui LIN
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Publication number: 20230340142Abstract: Disclosed herein are anti-PD-L1 antibodies and antigen-binding fragments thereof, fusion proteins comprising a first domain comprising an anti-PD-L1 antibodies or an antigen-binding fragment thereof and a second domain comprising a fragment of TGF?RII that binds TGF? or a variant thereof, as well as polynucleotides that encode such antibodies or fusion proteins. Disclosed herein are also their uses in treatment of diseases such as cancers.Type: ApplicationFiled: January 26, 2023Publication date: October 26, 2023Inventors: Binbin Wang, Dong Wang, Jinyu Dong, Yu Zhang, Zhou Zhou, Liegang Shao, Lianqi Zhao, Xin Dong, Baiyang Wang
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Publication number: 20230325563Abstract: Various embodiments of the teachings herein include an environment prediction method based on a target available model. An example method comprises: generating a training sample based on predetermined environment data; using the training sample to perform training based on a fluid dynamics model and a Gaussian simulation model, to obtain a target available model; and based on real environment data, using the target available model to determine a real environment prediction value of a time-related pollution concentration sequence for a calibration position.Type: ApplicationFiled: September 11, 2020Publication date: October 12, 2023Applicant: Siemens Ltd., ChinaInventors: Xiao Zhou Zhou, Tian Rui Sun, Xiao Liang, Daniel Schneegaß
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Publication number: 20230223320Abstract: A semiconductor device package and a method for manufacturing the same is provided. The semiconductor device package includes a semiconductor die having an electronic component integrated thereon and having a die terminal that is electrically connected to the electronic component, a stress relief substrate fixedly and electrically connected to the die terminal, and a clip lead. The substrate is configured to provide an electrical short between the clip lead and the die terminal. The stress relief substrate may form an interface between the clip lead and the semiconductor die and can thereby reduce stress exerted on the semiconductor die by the clip lead.Type: ApplicationFiled: January 12, 2023Publication date: July 13, 2023Applicant: NEXPERIA B.V.Inventors: Ricardo Yandoc, Adam Brown, Zhou Zhou
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Patent number: 11688389Abstract: Disclosed is a method for processing a voice signal applicable to a terminal. The method can include: receiving a first voice signal; sending the first voice signal to a server in response to determining that the first voice signal includes a preset wake-up word; and receiving a second voice signal in response to receiving an acknowledgement result from the server, and responding to an interaction instruction corresponding to the second voice signal in a live streaming room.Type: GrantFiled: September 3, 2020Date of Patent: June 27, 2023Assignee: Beijing Dajia Internet Information Technology Co., Ltd.Inventors: Xiaobo Zhang, Qi Zhang, Zhou Zhou
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Publication number: 20230178507Abstract: This disclosure relates to a new package concept that eliminates the need for epoxy or epoxy solder used in traditional clip/lead frame-based power packages. The disclosure overcomes this disadvantage in clip-based packages by depositing the interconnect structure directly to the bod pads. The formation of the interconnect done at lower temperature leads to lower stress induced onto the die. Another advantage of the present disclosure is that semiconductor dies packaged using a method according to the present disclosure will have smaller footprint as the pads are directly built up/deposited. Another advantage of the method according to the present disclosure is that it allows large scale, i.e., panel level processing. Such a panel may include multiple ICs, or transistor or any other semiconductor devices.Type: ApplicationFiled: December 2, 2022Publication date: June 8, 2023Applicant: NEXPERIA B.V.Inventors: Randolph Estal Flauta, Kan Wae Lam, Wai Hung William Hor, Zhou Zhou
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Publication number: 20230146666Abstract: An electronic package and method for manufacturing is provided. The package includes an electronic component having a terminal, a solidified molding compound encapsulating the electronic component, a lead including an inner and a mounting portion. The molding compound includes a first recess at or near a perimeter of a bottom surface of the mounting portion, exposing a portion of a bottom surface of the inner portion arranged near the mounting portion, and/or a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing a portion of a side surface of the mounting portion extending between the top and the bottom surface of the mounting portion. The package provides more exposed lead space for a larger solder covering area using the first and/or second recess. Thus, solder strain accumulation is reduced or mitigated, and reliability of the electronic package can be enhanced.Type: ApplicationFiled: November 8, 2022Publication date: May 11, 2023Applicant: NEXPERIA B.V.Inventors: Zhou Zhou, Haibo Fan, Chi Ho Leung
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Publication number: 20230104485Abstract: Methods, systems, and devices for improved implicit ordered command handling are described. For instance, a memory device may receive, from a host device, a first command and a second command. The memory device may determine whether a first memory operation associated with the first command and a second memory operation associated with the second command are to be performed in an order relative to each other based on a first time when the first command is received relative to a second time when the second command is received. The memory device may select whether to perform a first memory access procedure or a second memory access procedure based on whether the first memory operation and the second memory operation are a same type of memory operation and on whether the first memory operation and the second memory operation are to be performed in the order relative to each other.Type: ApplicationFiled: February 18, 2021Publication date: April 6, 2023Inventors: Huachen Li, Zhou Zhou, Chaofeng Zhang, Jianfeng Li, Chen Huang, Lin Huang, Wei LI
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Publication number: 20220380789Abstract: The present invention is directed to a transgenic soybean plant having increased oleic acid content comprising a polynucleotide comprising a fatty acid thioesterase (FAT) related promoter that functions in the soybean plant operably linked to a polynucleotide encoding a polypeptide having FAT activity. The invention is further directed to a method of increasing oleic acid content of a soybean plant comprising transforming a soybean plant with a polynucleotide comprising a fatty acid thioesterase (FAT) related promoter that functions in the soybean plant operably linked to a polynucleotide encoding a polypeptide having FAT activity.Type: ApplicationFiled: May 27, 2022Publication date: December 1, 2022Applicant: Board of Trustees of Southern Illinois UniversityInventors: Khalid Meksem, Naoufal Lakhssassi, Dounya Knizia, Zhou Zhou
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Patent number: 11472676Abstract: A nonlinear resonance model-based active filtering crane steel rope resonance elimination control method, including: constructing a two-dimensional dynamic model of a bridge crane according to a Lagrange's equation; constructing a steel wire rope-motor nonlinear resonance model to detect a harmonic; and eliminating the harmonic by means of active filtering. The present disclosure makes in-depth study on positioning of a crane and intelligent control of an anti-swing and resonance elimination control system and uses active filtering to eliminate resonance between a heavy object and the steel wire rope, thereby reducing a swinging angle and achieving the rapid resonance elimination and anti-swing effect. The active filtering technology can quickly and effectively detect a resonance current so as to effectively suppress resonance between the heavy object and the steel wire rope, and further helps a controller quickly and accurately position a trolley to further improve anti-swing performance.Type: GrantFiled: July 29, 2021Date of Patent: October 18, 2022Assignees: Wuhan University of Science and Technology, Sinosteel Wuhan Safey & Environment Protection ResearchInventors: Huikang Liu, Sen Lin, Xianhua Wang, Qiangguang Lu, Lin Chai, Yikang Zu, Zhou Zhou, Dongtian Liu, Qing Yu, Weijia Wang
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Patent number: D1018028Type: GrantFiled: July 14, 2023Date of Patent: March 19, 2024Inventor: Zhou Zhou