Abstract: The present application discloses a dispatching and control cloud data processing method, device and system. The method includes the following operations: pilot node device acquires a global scheduling task, decomposes the global scheduling task to obtain scheduling tasks, issues the scheduling tasks to collaborative node device, acquires data collection ranges and data processing rules of the collaborative node devices, and delivers them to the collaborative node devices; the collaborative node devices receive and execute the scheduling tasks issued by the pilot node device; receives the data collection ranges and the data processing rules issued by the pilot node device, acquires, based on the scheduling tasks, collected data in the data collection ranges, processes the acquired collected data according to the data processing rules to obtain the processed data, uploads the processed data to the pilot node device; the pilot node device receives the processed data uploaded by the collaborative node devices.

Abstract: The present invention provides a support for temporary bonding a workpiece such as a thick device wafer. The support comprises a carrier having a supporting surface and an isolation film. A first side of the isolation film is bonded to the supporting surface with a peeling strength of from 0.01 to 50.0 g/cm. The invention also provides a method of using the support to e.g. grind the workpiece in making thinned products such as thin silicon wafer, optical lens, thin LCD glass, and thin rock crystal wafer, among others.

Abstract: The present invention provides a support for temporary bonding a workpiece such as a thick device wafer. The support comprises a carrier having a supporting surface and an isolation film. A first side of the isolation film is bonded to the supporting surface with a peeling strength of from 0.01 to 50.0 g/cm. The invention also provides a method of using the support to e.g. grind the workpiece in making thinned products such as thin silicon wafer, optical lens, thin LCD glass, and thin rock crystal wafer, among others.