Abstract: Methods and apparatus for beam management where a beam is selected based on an estimated channel correlation matrix. The apparatus determines a channel correlation matrix based on downlink SSB reference signal received at the UE. The apparatus estimates a RSRP of a plurality of beams associated with an uplink channel based on the channel correlation matrix and associated beam weights. The apparatus selects a first beam from the plurality of beams having a highest estimated RSRP for communication with a base station. The apparatus communicates with the base station via the first beam.

Abstract: A first communication device generates an Operation, Administration, and Maintenance (OAM) frame that includes i) OAM message content and ii) an OAM frame header outside of the OAM message content, wherein generating the OAM frame comprises generating the OAM frame header to include information that signals one of i) a low power sleep (LPS) request, and ii) a wake-up request (WUR). The first communication device transmits the OAM frame to a second communication device via a communication medium to signal to the second communication device the one of i) the LPS request, and ii) the WUR.

Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.

Abstract: Methods of using PCSK9 antagonists. More specifically, methods for measuring circulating PCSK9 levels in a biological sample by means of an immunoassay.

Abstract: Substantially transparent electrodes are formed upon a substrate by forming on the substrate, in order, a high index layer, a metallic conductive layer, and a conductive or semi-conductive top layer; and patterning the top layer and the conductive layer, preferably by laser ablation, to form a plurality of discrete electrodes from the metallic conductive layer. Conductors can be attached directly to the top layer, without requiring removal of this layer to expose the metallic conductive layer. The high index layer, conductive layer and top layer can all be formed by sputtering or similar processes which do not require high temperatures, so that plastic substrates can be used. The electrodes can be used, for example, in flat panel displays and in touch screen displays.