Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.

Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.

Abstract: A brushless direct current electric motor assembly includes a housing having a first end and a second end and a stator disposed in the housing. The assembly further includes a rotor subassembly disposed in the stator, the rotor subassembly having a shaft having a first end proximate the first end of the housing and a second end proximate the second end of the housing. The assembly further includes a controller disposed in the housing, the controller configured to control rotation of the shaft. The first end of the shaft is configured to provide a rotational output.

Abstract: A brushless direct current electric motor assembly includes a housing having a first end and a second end and a stator disposed in the housing. The assembly further includes a rotor subassembly disposed in the stator, the rotor subassembly having a shaft having a first end proximate the first end of the housing and a second end proximate the second end of the housing. The assembly further includes a controller disposed in the housing, the controller configured to control rotation of the shaft. The first end of the shaft is configured to provide a rotational output.

Abstract: An apparatus and method for a two semiconductor device package where the semiconductor devices are connected in electrical series. The first device is mounted P-side down on an electrically conductive substrate. Non-active area on the P side is isolated from the electrically conductive substrate. The second device is mounted P-side up at a spaced apart location on the substrate. Opposite sides of each are electrically connected to leads to complete the series connection of the two devices. A method of manufacturing such a package includes providing an electrically conductive lead frame, mounting one device P-side up and flipping the other device and mounting it P-side down on the lead frame with non-active area of the P side isolated from the lead frame, and connecting the other side of each device to separate leads. Isolation of the non-active area of the P side of the device can be through modification of the substrate or lead frame surface by grooves or raised portions.

Abstract: An apparatus and method for a two semiconductor device package where the semiconductor devices are connected in electrical series. The first device is mounted P-side down on an electrically conductive substrate. Non-active area on the P side is isolated from the electrically conductive substrate. The second device is mounted P-side up at a spaced apart location on the substrate. Opposite sides of each are electrically connected to leads to complete the series connection of the two devices. A method of manufacturing such a package includes providing an electrically conductive lead frame, mounting one device P-side up and flipping the other device and mounting it P-side down on the lead frame with non-active area of the P side isolated from the lead frame, and connecting the other side of each device to separate leads. Isolation of the non-active area of the P side of the device can be through modification of the substrate or lead frame surface by grooves or raised portions.