Abstract: The present disclosure describes multi-parameter dynamic sampling methods and systems. An example method includes: configuring two sampling rates for each parameter in a set of sampling parameters; selecting one of the sampling rates for each parameters to sample it; calculating a load for each parameter at the selected sampling rate, sorting the parameters according to the loads, and determining high-loaded parameters according to a sorting result; and determining whether each parameter has data loss, and if at least one of the sampling parameters has data loss, performing down-sampling on the high-loaded sampling parameters within a range of the configured at least two sampling rates.

Abstract: A method is provided for imaging a region of interest. The method includes defining a lamella within a microelectronic device, where the region of interest is in the lamella. The lamella has a first and second surface, and a first sacrificial layer contacts the first surface. The region of interest includes a material of interest, and an imaging technique capable of detecting the material of interest is selected. A support layer is formed on the second surface, where the support layer is transparent to the imaging technique. The first sacrificial layer is removed, and an image of the region of interest is produced.