Abstract: Compositions and methods for controlling pests are provided. The methods involve transforming organisms with a nucleic acid sequence encoding an insecticidal protein. In particular, the nucleic acid sequences are useful for preparing plants and microorganisms that possess insecticidal activity. Thus, transformed bacteria, plants, plant cells, plant tissues and seeds are provided. Compositions are insecticidal nucleic acids and proteins of bacterial species. The sequences find use in the construction of expression vectors for subsequent transformation into organisms of interest including plants, as probes for the isolation of other homologous (or partially homologous) genes. The pesticidal proteins find use in controlling, inhibiting growth or killing Lepidopteran, Coleopteran, Dipteran, fungal, Hemipteran and nematode pest populations and for producing compositions with insecticidal activity.

Abstract: A circuit board includes at least one first circuit substrate and at least one second circuit substrate overlapped with the first circuit substrate; each first circuit substrate includes: a first base layer, a first circuit layer, and a plurality of first conductive bodies formed by an electroplating process; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; each second circuit substrate includes: a second base layer, a second circuit layer and a plurality of second conductive bodies including a conductive paste; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer.

Abstract: Systems, methods, and apparatuses are provided for a single or multi-dimmer system having improved reliable connectivity between a dimmer assembly and a switch or between two or more dimmer assemblies.

Abstract: The present disclosure discloses an audio communication method having two-way high quality audio transmission mechanism that includes steps outlined below. Communication between an audio communication apparatus and an external audio communication apparatus is performed to establish an audio link. An ability negotiation process is performed to determine the external audio communication apparatus supports ACL link technology. A coding negotiation process is performed to negotiate an audio encoding and decoding parameter. An audio delay negotiation process is performed to provide a first audio data delay parameter to the external audio communication apparatus and retrieve a second audio data delay parameter from the external audio communication apparatus to further determine an actual audio data delay parameter. A two-way audio transmission is performed according to the audio encoding and decoding parameter and the actual audio data delay parameter with the external audio communication apparatus.

Abstract: A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.

Abstract: The present invention discloses a grinder, comprising an upper shell, a lower shell, a PCB, a charging contact piece and a battery, wherein the lower end of the upper shell is connected to the upper end of the lower shell, the PCB is electrically connected to the battery, one end of the charging contact piece is electrically connected to the PCB, the battery and the PCB are both connected to the inside of the upper shell, and the other end of the charging contact piece protrudes from and is exposed on the side of the upper shell. In the present invention, the charging contact piece is provided on the side of the grinder to realize side contact charging, the structures related to the charging function are provided in the upper shell, and providing the structures related to the switched-on circuit in the lower shell is avoided.

Abstract: In an uplink frequency hopping method and device, whether the weather is bad is determined; when the weather is bad, rain attenuation is estimated according to a preset rainfall estimation model and a preset rainfall monitoring system; when the rain attenuation is not less than a first preset threshold, a variable factor is generated; and when the variable factor exists, an uplink frequency is adjusted according to a preset frequency hopping algorithm.

Abstract: A method for manufacturing a circuit board comprising: providing an inner circuit substrate board comprising a first transmission area, a bendable area, and a second transmission area which are connected in an order, wherein the inner circuit substrate board further comprises a substrate layer and an inner circuit layer on the substrate layer, the inner circuit layer comprises a first signal circuit; pressing a first outer circuit substrate board on the inner circuit layer; wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer; the first dielectric layer is located in the first transmission area and the second transmission area; two ends of the first signal circuit are electrically connected to the first outer circuit layer.

Abstract: Systems, methods, and apparatuses are provided for a single or multi-dimmer system having improved reliable connectivity between a dimmer assembly and a switch or between two or more dimmer assemblies.

Abstract: A method for manufacturing a circuit board comprising: providing an inner circuit substrate board comprising a first transmission area, a bendable area, and a second transmission area which are connected in an order, wherein the inner circuit substrate board further comprises a substrate layer and an inner circuit layer on the substrate layer, the inner circuit layer comprises a first signal circuit; pressing a first outer circuit substrate board on the inner circuit layer; wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer; the first dielectric layer is located in the first transmission area and the second transmission area; two ends of the first signal circuit are electrically connected to the first outer circuit layer.

Abstract: A transmission circuit board includes a bendable area, a first transmission areas, and a second transmission areas. The first and second transmission areas are connected to the bendable area. The inner circuit substrate board further includes a substrate layer and an inner circuit layer formed on the substrate layer and including a first signal circuit. The transmission circuit board further includes a first dielectric layer formed on the inner circuit layer, a first outer circuit layer formed on the first dielectric layer, a first protecting layer formed on the first outer circuit layer, and a first shielding layer formed on the first protecting layer. The first dielectric layer lies the first and second transmission areas. Two ends of the first signal circuit are connected to the first outer circuit layer. The first shielding layer is connected to the first outer circuit layer and lies the bendable area.

Abstract: A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.

Abstract: A transmission circuit board includes a bendable area, a first transmission areas, and a second transmission areas. The first and second transmission areas are connected to the bendable area. The inner circuit substrate board further includes a substrate layer and an inner circuit layer formed on the substrate layer and including a first signal circuit. The transmission circuit board further includes a first dielectric layer formed on the inner circuit layer, a first outer circuit layer formed on the first dielectric layer, a first protecting layer formed on the first outer circuit layer, and a first shielding layer formed on the first protecting layer. The first dielectric layer lies the first and second transmission areas. Two ends of the first signal circuit are connected to the first outer circuit layer. The first shielding layer is connected to the first outer circuit layer and lies the bendable area.

Abstract: A multilayer circuit board includes a first connecting wiring board comprising a first bonding layer and a liquid crystal polymer formed on the first bonding layer. The first bonding layer comprises a first insulating filler. A fusion temperature of the first bonding layer is less than a fusion temperature of the liquid crystal polymer. The multilayer circuit board further includes a first wiring board and a second wiring board disposed on opposite sides of the first connecting wiring board. The first wiring board is combined with the first bonding layer. A method for manufacturing such multilayer circuit board is also provided.

Abstract: Systems, methods, and apparatuses are provided for a single or multi-dimmer system having improved reliable connectivity between a dimmer assembly and a switch or between two or more dimmer assemblies.

Abstract: A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

Abstract: A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

Abstract: An intuitive computer data management system, includes a UI (User Interface), a categorizing module, and an accessing module. The UI provides at least one prompt to a user so that the user can follow the prompt to send an access request for computer readable data in one action. The categorizing module automatically determines the type of computer readable data according to the access request given by the user. The accessing module then processes the computer readable data according to the determined type.