Abstract: The present disclosure discloses an electromagnetic microphone including: a housing; a circuit board; and a sound transducer, including: a substrate including a back cavity, a vibrator mounted on a side of the substrate away from the circuit board and covering the back cavity, including: a membrane; and a magnetic component mounted on the membrane and configured to generate magnetic field; a coil located within the magnetic field of the magnetic component; a sound hole penetrated on the housing or the circuit board is configured to communicate with the back cavity; when external sound wave transmitted from the sound hole and the back cavity acts on the membrane, the magnetic component and the coil interact to generate electrical signal. The electromagnetic microphone in the present disclosure has higher sensitivity, reliability and stability.

Abstract: The present invention discloses a MEMS microphone, which includes a substrate with a back cavity, a connection part, and a capacitive system arranged in the connection part. The capacitive system includes a first electrode connected to the inner wall of connection part, and a second electrode disposed on the substrate near the first electrode and spaced from the first electrode. The second electrode has two shape separation gaps. The shape separation gap includes a splitting gap in the second electrode, and two end gaps. The second electrode is divided into an effective vibration area and an auxiliary area by adopting a cracking gap structure. While improving the sensitivity of the first electrode, the stress concentration point of the second electrode is directed to the edge of the second electrode, so as to disperse the stress under the action of loud pressure.

Abstract: The present disclosure discloses a Micro-Electro-Mechanical System (MEMS) microphone including a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate, the diaphragm located on a side of the back plate close to the substrate; a support member located between the diaphragm and the back plate; a blocking portion arranged on a side of the back plate facing the diaphragm; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the back plate are fixedly connected by the support member, a projection of the blocking portion along a vibration direction of the diaphragm is located within the vibration portion of the diaphragm. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high signal-to-noise ratio.

Abstract: The present disclosure discloses a sound transducer including a substrate; a back plate mounted on the substrate; a back plate electrode mounted on a side of back plate facing the substrate, including a plurality of first electrode plates arranged at intervals; a diaphragm electrode opposite to the back plate along a first direction, including: a plurality of second electrode plates arranged at intervals; and a center pillar arranged between the back plate and the diaphragm electrode, extending along the first direction; the plurality of first electrode plates surrounds the center pillar; the plurality of second electrode plates surrounds the center pillar; each second electrode plate is flexibly connected to the center pillar. The sound transducer in the present disclosure has sound localization function.

Abstract: The present disclosure discloses a MEMS microphone, including: a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the fixing portion are spaced apart from each other by a slit, the fixing portion includes a plurality of releasing portions, and the releasing portions pass through the fixing portion. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high reliability of the back plate.

Abstract: A microphone chip and a microphone are provided. The microphone chip includes a substrate and a capacitive system disposed on the substrate. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate. The diaphragm includes an inner membrane portion, at least one outer membrane portion, and at least one supporting portion. The microphone chip further includes a supporting member. In an operating state, the inner membrane portion is adsorbed on the supporting member, and the supporting member is configured to divide the inner membrane portion into at least two regions. The diaphragm in the operating state is divided by the supporting member into a plurality of floating regions separated from each other, such that the rigidity of the diaphragm can be effectively adjusted and enhanced according to requirements.

Abstract: The present disclosure discloses a MEMS microphone, including: a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the fixing portion are spaced apart from each other by a slit, the fixing portion includes a plurality of releasing portions, and the releasing portions pass through the fixing portion. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high reliability of the back plate.

Abstract: A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.

Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system located on the substrate, including a back plate and a diaphragm opposite to the back plate, wherein the back plate includes a body portion, a fixing portion connected with the body portion and the substrate, and a plurality of strip reinforcing ribs, the reinforcing ribs are protruded from the body portion. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the strength of the back plate.

Abstract: An MEMS microphone includes a substrate with a back cavity and a capacitor system arranged on the substrate. The capacitor system includes a back plate and a diaphragm opposite to and spaced apart from the back plate. Surface of the back plate facing diaphragm or surface of diaphragm facing the back plate being provided with an anti-adhesion member. When the diaphragm moves until the anti-adhesion member is in contact with the diaphragm and the back plate at the same time, the anti-adhesion member is elastically deformable along a vibrating direction of the diaphragm. The anti-adhesion member of the present disclosure is elastic and may provide cushioning for movement of the diaphragm, which prevents rapid concentration of stress at a position of the diaphragm in contact with the anti-adhesion member, thereby preventing formation of pits in the diaphragm and preventing breakage of the diaphragm under repeated impact of the anti-adhesion member.

Abstract: The present disclosure discloses a MEMS microphone chip having a substrate with a back cavity, a back plate fixed to the substrate, and a diaphragm unit opposite to the back plate. The diaphragm unit includes a first diaphragm spaced apart from the back plate, a support member fixed on a side of the first diaphragm away from the back cavity, and a second diaphragm spaced apart from the first diaphragm. The second diaphragm includes a support portion fixed to the support member and a free end. The first diaphragm is utilized to drive the second diaphragm having the free end so that the vibration of the second diaphragm from is no longer subject to its thickness and stress, thus significantly improving the sensitivity of the MEMS microphone chip and accordingly improving the SNR.

Abstract: The present disclosure discloses a MEMS microphone including a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate, the diaphragm located on a side of the back plate close to the substrate; a support member located between the diaphragm and the back plate; a blocking portion arranged on a side of the back plate facing the diaphragm; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the back plate are fixedly connected by the support member, a projection of the blocking portion along a vibration direction of the diaphragm is located within the vibration portion of the diaphragm. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high signal-to-noise ratio.

Abstract: A MEMS microphone includes a substrate, a base, a capacitance system, and at least one cantilever structure. The substrate includes a back cavity, the base is disposed on one side of the substrate, and the capacitance system is disposed on the base. The capacitance system includes at least one back plate assembly, at least one first vibration diaphragm, and at least one second vibration diaphragm. The at least one first vibration diaphragm includes a first sub-vibration diaphragm, and the at least one second vibration diaphragm includes a second sub-vibration diaphragm. The sub-vibration diaphragm and the second sub-vibration diaphragm form a cantilever beam structure on the base, which increase compliance of the at least one first vibration diaphragm and the at least one second vibration diaphragm and reduce tension of the at least one first vibration diaphragm and the at least one second vibration diaphragm, thereby improving sensitivity of the microphones.

Abstract: Provided is a diaphragm and a micro-electromechanical system (MEMS) microphone. The diaphragm includes a vibrating portion and a support structure. The support structure includes a cantilever portion. Lengths of the first and second anchoring portion both extend along a circumferential direction of the vibrating portion, and a length extension direction of the first anchoring portion is opposite to that of the second one. The lengths of the first and second anchoring portions both extend along the circumferential direction of the vibrating portion, and the length extension direction of the first anchoring portion is opposite to that of the second one, so that the first and second anchoring portions and the cantilever portion are connected in a T shape. A vibration displacement range of the diaphragm is larger, thereby improving sensitivity and compliance of the MEMS microphone.

Abstract: The present invention provides a diaphragm and a MEMS sensor using the diaphragm. The diaphragm is a rectangular diaphragm, and the diaphragm includes a main body of the diaphragm and fixed parts arranged outside the main body of the diaphragm and located at the four corners of the diaphragm. The four corners of the rectangular diaphragm are depressed parts formed by concave in the direction of the diaphragm main body. The fixed part includes at least two fixed anchor points arranged along the edge of the diaphragm forming the depressed part. The present invention improves the effective sensing area of the diaphragm and the acoustic performance of the MEMS sensor.

Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system including a back plate and a diaphragm located on the substrate, the back plate includes a body portion and a first protrusion, the diaphragm includes a main portion and a second protrusion, the first protrusion is corresponding to the second protrusion, the substrate includes an upper end close to the capacitive system and a lower end away from the capacitive system, an opening of the back cavity at the upper end of the substrate is larger than an opening at the lower end of the substrate. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the resonant frequency.

Abstract: A MEMS microphone includes a substrate, a supporting plate, a capacitor system, a first pad, and a first electrode. The substrate defines a back cavity, the supporting plate is disposed at one side of the substrate and defines an accommodation cavity, and the capacitor system is disposed at the supporting plate. The capacitor system includes a back plate, a fixing component, and a vibrating diaphragm. The vibrating diaphragm is fixed to one side of the fixing component distal from the back plate. The vibrating diaphragm forms a cantilever structure fixing at the middle, and the first electrode is only connected to a central region of the vibrating diaphragm, the first electrode may not interfere with deformation of an edge region of the vibrating diaphragm, thereby improving sensitivity of the MEMS microphone through fully releasing residual stress of the vibrating diaphragm.

Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system located on the substrate, including a back plate and a diaphragm opposite to the back plate, wherein the back plate includes a body portion, a fixing portion connected with the body portion and the substrate, and a plurality of strip reinforcing ribs, the reinforcing ribs are protruded from the body portion. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the strength of the back plate.

Abstract: A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.

Abstract: A microphone chip and a microphone are provided. The microphone chip includes a diaphragm and a back plate. When the sound wave drives the diaphragm to vibrate through the sound hole, a distance between the electrode sheet and the diaphragm changes, and a capacitance value of the capacitance system changes, thereby converting the sound wave signal into an electrical signal. In the direction perpendicular to the back plate, the outer contour of the projection of each protrusion on the diaphragm and an outer contour of a corresponding fold of the plurality of folds do not intersect, so as to prevent the protrusion from contacting and getting stuck with the side wall of the fold in the process of external vibration or excessive blowing, which may lead to adhesion between the diaphragm and the back plate and affection of the normal operation of the microphone chip.