Patents by Inventor Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd.

Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single Layer Coreless Substrate
    Publication number: 20140167234
    Abstract: An electronic chip package comprising at least one chip bonded to a routing layer of an interposer comprising a routing layer and a via post layer that is surrounded by a dielectric material comprising glass fibers in a polymer matrix, wherein the electronic chip package further comprises a second layer of a dielectric material encapsulating the at least one chip, the routing layer and the wires, and methods of fabricating such electronic chip packages.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd.
    Inventor: Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd.