Abstract: The invention discloses a printed circuit board compensation processing method for fabricating a BGA despite a small distance between a line and a pad of the BGA. The method includes compensating a pad and/or a line under a predetermined condition, and removing a portion of the pad facing the line by a second predetermined width when the shortest distance between the compensated line and pad is smaller than a first predetermined distance. The invention further discloses a device for performing the method and a PCB fabricated using the method.

Abstract: A method of manufacturing a printed circuit board (PCB) is provided. The method includes defining an area on the PCB to be subjected to a controlled-depth milling. The area includes a warp. The method further includes providing a plurality of positioning holes adjacent to edges of the area of the PCB, installing positioning members in the positioning holes so as to fix the PCB on a flat surface of a table of a milling equipment, and milling the area of the PCB. A PCB is also provided. The PCB includes a controlled-depth area containing patterns and having a surface lower than a surface of the PCB. The PCB further includes a plurality of positioning holes formed adjacent to edges of the controlled-depth area.

Abstract: A method for detecting a registration offset is disclosed. The method includes transferring a first pattern to a metal layer on a first side of a printed circuit board (PCB) substrate. The first pattern has a reference scale. The method further includes transferring a second pattern to a metal layer on a second side opposite to the first side of the PCB substrate. The second pattern has a measurement scale. The second pattern is transferred by aligning an origin of the measurement scale with an origin of the reference scale in an apparatus such that at least a portion of the reference scale is overlapped with the measurement scale. The method includes etching the metal layers of the PCB substrate and measuring an offset in the patterns on the PCB substrate by using the reference scale and the measurement scale.