Abstract: The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

Abstract: The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

Abstract: The disclosure is directed to an electronic package with an interposer between integrated circuit dies. At least one inner capacitor (e.g., single layer capacitor) is mounted to the interposer. The electronic package further includes an input passive circuit substrate and an output passive circuit substrate mechanically coupled to the metal base. Use of an interposer to be simultaneously solder attached with integrated circuit dies provides a configuration that improves linearity performance and/or wide video bandwidth of the electronic package (e.g., packages that use epoxy and laminate interposers). Further, such configuration facilitates efficient manufacturing of the electronic package at high volumes.

Abstract: A method and apparatus for rapid and dynamic RF and Microwave circuit prototyping and integration provides a standard test fixture for testing any single device from any device vendors, provides a rapid dynamic tool for sub-system and system integration and prototyping, provides a flexibility to make any single function or multi-function assembled module quickly and economically. This prototyping approach can help RF/microwave companies share development times and costs. The combination of standard PCB function cells and dynamic standard mechanical cells helps build a prototype design quickly and reduce R&D costs.