Abstract: A method of post treatment of the surface of an additive manufactured object is described. The method can include steps of coating at least part of the surface with a curable silicone composition and then curing the coating at room temperature or by heat or UV radiation. The curable silicone composition can have a viscosity in a range from 300 mPa·s to 500 000 mPa·s. A 3D printing method is also described that includes this method and also a post treatment agent including the curable silicone composition.

Abstract: In a method for configuring and managing a Time Sensitive Networking (TSN) network, a network packet is regularly captured and parameters are extracted. The parameters are submitted to a distributed learning model for matching an application according to the parameters, and a network requirement of the application is obtained. Such obtained network requirements are uploaded to a centralized network configuration (CNC) through a message transmission protocol, and a configuration of the network requirement is calculated through the CNC. The configuration calculated by the CNC is received and delivered to a TSN switch, causing the TSN switch to dynamically update the network configuration accordingly.

Abstract: The present disclosure discloses an anti-backflow output switch, a collector of the tertiary tube Q6 is connected to the source of the MOS tube Q4 through a resistor R24 and a diode ZD2, a resistor R30 is connected between the source and the gate of the MOS tube Q4, the drain of the MOS tube Q4 is connected to the drain of the MOS tube Q9, a resistor R25 and a diode D5 are connected to the gate of the MOS tube Q9, a resistor R28 is connected between the gate and the source of the MOS tube Q9, a resistor R33 is connected between the drain of the MOS tube Q10, a resistor R37 is connected between the gate and the source of the MOS tube Q10, the gate of the MOS tube Q10 is connected to a first pin of the chip U2 through a resistor R35, a resistor R34 and a resistor R38 are connected to the second pin and the third pin of the chip U2 respectively, a resistor R39 and a capacitor C35 are connected between the first pin and the second pin of the chip U2, the second pin of the chip U2 is connected to a fourth pin of t

Abstract: In a method for configuring and managing a Time Sensitive Networking (TSN) network, a network packet is regularly captured and parameters are extracted. The parameters are submitted to a distributed learning model for matching an application according to the parameters, and a network requirement of the application is obtained. Such obtained network requirements are uploaded to a centralized network configuration (CNC) through a message transmission protocol, and a configuration of the network requirement is calculated through the CNC. The configuration calculated by the CNC is received and delivered to a TSN switch, causing the TSN switch to dynamically update the network configuration accordingly.