Patents by Inventor Zhuozhi Chen

Zhuozhi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTISPECIFIC ANTIGEN BINDING PROTEINS
    Publication number: 20240076411
    Abstract: This disclosure provides multispecific and multivalent antigen binding proteins. In one aspect, the disclosure provides a multispecific antigen binding protein, comprising a first antigen binding site comprising a first VHH that specifically binds to a first epitope; and a second antigen binding site that specifically binds to a second epitope.
    Type: Application
    Filed: December 29, 2021
    Publication date: March 7, 2024
    Inventors: Xinzhao FAN, Jianqing XU, Yunying CHEN, Xiaofeng LU, Yongqing CHENG, Zhuozhi WANG, Jijie GU
  • Vision-based wafer notch position measurement
    Patent number: 9831110
    Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: November 28, 2017
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Gustavo G. Francken, Brandon Senn, Peter Thaulad, Zhuozhi Chen, Richard K. Lyons, Christian DiPietro, Christopher M. Bartlett
  • VISION-BASED WAFER NOTCH POSITION MEASUREMENT
    Publication number: 20170032510
    Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module that calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.
    Type: Application
    Filed: July 30, 2015
    Publication date: February 2, 2017
    Inventors: Gustavo G. Francken, Brandon Senn, Peter Thaulad, Zhuozhi Chen, Richard K. Lyons, Christian DiPietro, Christopher M. Bartlett