Patents by Inventor Zhuqiu WANG

Zhuqiu WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package, terminal and method for processing electronic package
    Patent number: 11367700
    Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: June 21, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Hongbin Shi, Zhuqiu Wang, Runqing Ye, Haohui Long
  • ELECTRONIC PACKAGE, TERMINAL AND METHOD FOR PROCESSING ELECTRONIC PACKAGE
    Publication number: 20200343210
    Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.
    Type: Application
    Filed: December 29, 2017
    Publication date: October 29, 2020
    Inventors: Hongbin SHI, Zhuqiu WANG, Runqing YE, Haohui LONG