Abstract: Provided by the invention disclosure is a coating equipment. The coating equipment comprises a reaction chamber body provided with a reaction chamber, a gas supply part configured to supply gas to the reaction chamber, a pumping device configured to communicate with the reaction chamber, a pulse power supply adapted to provide the reaction chamber body with a pulsed electric field and a radio frequency power supply adapted to provide the reaction chamber body with a radio frequency electric field, wherein the reaction chamber is adapted to accommodate a plurality of workpiece. When the pulse power supply and the radio frequency power supply are turned on, the gas in the reaction chamber body is ionized under the radio frequency electric field and the pulsed electric field to generate plasma, and the plasma is deposited on the surface of the workpieces.

Abstract: Provided in the present disclosure are a coating method and a film layer thereof, and a coating chucking appliance and an application thereof. The coating method comprises the steps of: forming a normal film layer on a first component on a substrate surface, and forming at least a thinner film layer on a second component on the substrate surface, wherein the thickness of the normal film layer is greater than the thickness of the thinner film layer. The coating method can prepare a thinner film layer on the surface of some portions or parts on the substrate surface, and prepare a thicker film layer on the surface of other portions or parts, thereby satisfying the requirements of coating a thinner film layer on some electronic components of the substrate, such as circuit interface components, ensuring data transmission performance.