Abstract: A heat dissipation module includes a first cooling pipeline, a second cooling pipeline, a first cold plate, a second cold plate, at least one heat pipe, a first cold plate bracket, and a second cold plate bracket. The first cooling pipeline is configured to input a cooling working substance, and the second cooling pipeline is configured to output the cooling working substance. The first cold plate bracket is configured to support the first cold plate, and the second cold plate bracket is configured to support the second cold plate. The first cold plate communicates with the first cooling pipeline and the second cooling pipeline. A contact surface of the first cold plate is in contact with a to-be-heat-dissipated part. The second cold plate communicates with the first cooling pipeline and the second cooling pipeline. The second cold plate is disposed at an interval from the first cold plate.

Abstract: The present invention discloses an electro-vibration coupled stress relief system, comprising a host computer, an arbitrary waveform card, a power amplifier, an electromagnetic exciter, an energy amplification device, an acceleration sensor, a charge amplifier, an oscilloscope, a power module, a charging module, an electric energy storage module, a discharge module, a pulse current sampling measurement module and a copper electrode.

Abstract: A method of generating monodispersed and homogenous microspheres comprising sirolimus is disclosed. The method can include producing sirolimus droplets using microfluidic step emulsification. The sirolimus droplets can include a drug loading wt % that is less than about 50% or about 100%. The method can further include washing the droplets to remove poly (vinyl alcohol). The method can also include removing solvent from the sirolimus droplets.

Abstract: Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan and a server mainboard. A server includes: a chassis, a backplane with a ventilation opening, a rear board, a first air ducting apparatus, and at least one fan module, where the backplane is located in the middle of the chassis, and the rear board is connected to a rear side of the backplane in a pluggable manner; the fan module is disposed side by side with the rear board along a horizontal direction, and is connected to the rear side of the backplane in a pluggable manner.

Abstract: Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan and a server mainboard. A server includes: a chassis, a backplane with a ventilation opening, a rear board, a first air ducting apparatus, and at least one fan module, where the backplane is located in the middle of the chassis, and the rear board is connected to a rear side of the backplane in a pluggable manner; the fan module is disposed side by side with the rear board along a horizontal direction, and is connected to the rear side of the backplane in a pluggable manner.