Abstract: A device for removing iron from a nickel-cobalt-manganese sulfuric acid solution and a method for continuously removing iron ions from a nickel-cobalt-manganese sulfuric acid solution. The device has an iron removal reactor (2) having a stirrer (3) and an iron removal reactor inner cylinder (5) and an aging reactor (9) having an aging reactor stirrer (7) and an automatic stone powder feeder (8), a mixing feed pipe (12) and a carbonate solution feed pipe (4) are arranged in an interlayer between the iron removal reactor (2) and the iron removal reactor inner cylinder (5), a mixer (1) for a preheating the device is arranged at a top of the mixing feed pipe (12), a compressed air inlet (11) and a feed inlet (10) of a solution to be subjected to iron removal are arranged in the mixer (1). Further disclosed is a method for removing iron of the device.

Abstract: The present disclosure provides a structured connector for positioning on, and electrically coupling to, a surface of a device component. The connector has a bottom portion for contacting the surface of the device component and comprises an electrically conductive material. Further the connector has at least one light diverting surface portion that is oriented relative to the surface of the device component such that, in use, light directed at normal incidence relative to the surface of the device component is received by the at least one light diverting surface portion such that the received light is diverted towards an exposed adjacent surface of the device component.

Abstract: The present disclosure provides a method of forming a device structure. The method comprises providing at least one device component having front and rear device component surfaces and having at least one electrically conductive region on at least one of the device component surfaces. The method further comprises providing at least one contact sheet comprising a polymeric material and at least one electrically conductive element that has a non-circular cross-sectional shape and is embedded in the polymeric material in a manner such that a surface portion of the at least one electrically conductive element is exposed. The method also comprises applying a bonding material to either one or both of the exposed surface portion and at least one of the electrically conductive regions on the at least one of the device component surfaces.