Patents by Inventor Zi Qun HUA
Zi Qun HUA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240332167Abstract: A three-dimensional (3D) memory device includes a memory stack including interleaved conductive layers and dielectric layers, a channel structure extending vertically through the memory stack, a first dielectric layer having a first dielectric material in contact with the memory stack and a plug of the channel structure, an intermedia dielectric layer on the first dielectric layer and having a second dielectric material different from the first dielectric material, a second dielectric layer on the intermedia dielectric layer, a slit structure extending along a lateral direction to separate the memory stack, a first contact penetrating the intermedia dielectric layer and the first dielectric layer, a second contact penetrating the second dielectric layer and in contact with at least the upper end of the first contact, a third contact penetrating the intermedia dielectric layer and the first dielectric layer, the third contact being in contact with the slit structure, and a fourth contact penetrating the secondType: ApplicationFiled: June 6, 2024Publication date: October 3, 2024Inventors: Hongbin Zhu, Juan Tang, Zi Qun Hua
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Patent number: 12074105Abstract: Embodiments of 3D memory devices are disclosed. In an example, a 3D memory device includes a memory stack, a structure penetrating the memory stack; a dielectric stack on the memory stack, and a contact structure penetrating the dielectric stack and being in contact with the structure. The dielectric stack comprises a first dielectric layer and a second dielectric layer having a first dielectric material, and an intermedia dielectric layer sandwiched by the first dielectric layer and the second dielectric layer, and having a second dielectric material different from the first dielectric material. The contact structure comprises a lower contact portion penetrating the first dielectric layer and the intermedia dielectric layer, the lower contact portion having a first lateral dimension, and an upper contact portion penetrating the second dielectric layer, the upper contact portion having a second lateral dimension less than the first lateral dimension.Type: GrantFiled: November 28, 2022Date of Patent: August 27, 2024Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Hongbin Zhu, Juan Tang, Zi Qun Hua
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Patent number: 11710730Abstract: A fabricating method of a semiconductor device is provided. A temporary semiconductor structure is provided. The temporary semiconductor structure includes a temporary substrate and a conductive layer, the temporary substrate has a first surface, the conductive layer is disposed on the first surface of the temporary substrate, and the conductive layer includes one or more first trace. Then, a recess is formed in the temporary semiconductor structure to form a first semiconductor structure and a first substrate. The recess penetrates through the first substrate and expose the one or more first trace. Thereafter, an input/output pad is formed in the recess and on the one or more first trace.Type: GrantFiled: September 13, 2021Date of Patent: July 25, 2023Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: He Chen, Zi Qun Hua, Shu Wu, Yong Qing Wang, Liang Xiao
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Patent number: 11664309Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a method for forming a 3D memory device is disclosed. A structure extending vertically through a memory stack including interleaved conductive layers and dielectric layers is formed above a substrate. A first dielectric layer is formed on the memory stack. An etch stop layer is formed on the first dielectric layer. A first contact is formed through the etch stop layer and the first dielectric layer and in contact with an upper end of the structure. A second dielectric layer is formed on the etch stop layer. A second contact is formed through the second dielectric layer and in contact with at least an upper end of the first contact.Type: GrantFiled: February 26, 2021Date of Patent: May 30, 2023Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Hongbin Zhu, Juan Tang, Zi Qun Hua
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Publication number: 20230102519Abstract: Embodiments of 3D memory devices are disclosed. In an example, a 3D memory device includes a memory stack, a structure penetrating the memory stack; a dielectric stack on the memory stack, and a contact structure penetrating the dielectric stack and being in contact with the structure. The dielectric stack comprises a first dielectric layer and a second dielectric layer having a first dielectric material, and an intermedia dielectric layer sandwiched by the first dielectric layer and the second dielectric layer, and having a second dielectric material different from the first dielectric material. The contact structure comprises a lower contact portion penetrating the first dielectric layer and the intermedia dielectric layer, the lower contact portion having a first lateral dimension, and an upper contact portion penetrating the second dielectric layer, the upper contact portion having a second lateral dimension less than the first lateral dimension.Type: ApplicationFiled: November 28, 2022Publication date: March 30, 2023Inventors: Hongbin Zhu, Juan Tang, Zi Qun Hua
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Patent number: 11552012Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate, a memory stack including interleaved conductive layers and dielectric layers above the substrate, a structure extending vertically through the memory stack, a first dielectric layer on the memory stack, an etch stop layer on the first dielectric layer, a second dielectric layer on the etch stop layer, a first contact through the etch stop layer and the first dielectric layer and in contact with an upper end of the structure, and a second contact through the second dielectric layer and in contact with at least an upper end of the first contact.Type: GrantFiled: September 19, 2019Date of Patent: January 10, 2023Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Hongbin Zhu, Juan Tang, Zi Qun Hua
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Patent number: 11462503Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first interconnect layer including first interconnects is formed above a first substrate. A first bonding layer including first bonding contacts is formed above the first interconnect layer, such that each first interconnect is in contact with a respective first bonding contact. A second interconnect layer including second interconnects is formed above a second substrate. A second bonding layer including second bonding contacts is formed above the second interconnect layer, such that at least one second bonding contact is in contact with a respective second interconnect, and at least another second bonding contact is separated from the second interconnects. The first and second substrates are bonded in a face-to-face manner, such that each first bonding contact is in contact with one second bonding contact at a bonding interface.Type: GrantFiled: October 6, 2020Date of Patent: October 4, 2022Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen, Zi Qun Hua
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Patent number: 11430775Abstract: A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a semiconductor structure and an input/output pad. The semiconductor structure includes a first substrate and a conductive layer, in which the first substrate has a first surface and a second surface opposite to each other, the conductive layer is disposed on the first surface of the first substrate, and the conductive layer includes one or more first trace. The first semiconductor structure has a recess penetrating the first substrate and exposing the one or more first trace, and the input/output pad is disposed on the one or more first trace and in the recess.Type: GrantFiled: October 8, 2019Date of Patent: August 30, 2022Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: He Chen, Zi Qun Hua, Shu Wu, Yong Qing Wang, Liang Xiao
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Patent number: 11430756Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first device layer is formed above a first substrate. A first bonding layer including a first bonding contact is formed above the first device layer. The first bonding contact is made of a first indiffusible conductive material. A second device layer is formed above a second substrate. A second bonding layer including a second bonding contact is formed above the second device layer. The first substrate and the second substrate are bonded in a face-to-face manner, such that the first bonding contact is in contact with the second bonding contact at a bonding interface.Type: GrantFiled: August 18, 2020Date of Patent: August 30, 2022Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Zongliang Huo, Jun Liu, Jifeng Zhu, Jun Chen, Zi Qun Hua, Li Hong Xiao
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Publication number: 20220130671Abstract: A method for forming a semiconductor structure including forming a plurality of mandrel lines on a first dielectric layer and forming one or more groups of discontinuous mandrel line pairs with a first mask. The method further includes disposing a second dielectric layer, and forming dielectric spacers on sidewalls of the mandrel lines and the discontinuous mandrel line pairs. The method further includes removing the mandrel lines and the discontinuous mandrel line pairs to form spacer masks, forming one or more groups of blocked regions using a second mask, and forming openings extended through the first dielectric layer with a conjunction of the spacer masks and the second mask. The method also includes removing the spacer masks and the second mask, disposing an objective material in the openings, and forming objective lines with top surfaces coplanar with the top surfaces of the first dielectric layer.Type: ApplicationFiled: January 11, 2022Publication date: April 28, 2022Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: Lu Ming FAN, Zi Qun HUA, Bi Feng LI, Qingchen CAO, Yaobin FENG, Zhiliang XIA, Zongliang HUO
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Patent number: 11251043Abstract: A method for forming a semiconductor structure including forming a plurality of mandrel lines on a first dielectric layer and forming one or more groups of discontinuous mandrel line pairs with a first mask. The method further includes disposing a second dielectric layer, and forming dielectric spacers on sidewalls of the mandrel lines and the discontinuous mandrel line pairs. The method further includes removing the mandrel lines and the discontinuous mandrel line pairs to form spacer masks, forming one or more groups of blocked regions using a second mask, and forming openings extended through the first dielectric layer with a conjunction of the spacer masks and the second mask. The method also includes removing the spacer masks and the second mask, disposing an objective material in the openings, and forming objective lines with top surfaces coplanar with the top surfaces of the first dielectric layer.Type: GrantFiled: June 23, 2020Date of Patent: February 15, 2022Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: Lu Ming Fan, Zi Qun Hua, Bi Feng Li, Qingchen Cao, Yaobin Feng, Zhiliang Xia, Zongliang Huo
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Publication number: 20210407984Abstract: A fabricating method of a semiconductor device is provided. A temporary semiconductor structure is provided. The temporary semiconductor structure includes a temporary substrate and a conductive layer, the temporary substrate has a first surface, the conductive layer is disposed on the first surface of the temporary substrate, and the conductive layer includes one or more first trace. Then, a recess is formed in the temporary semiconductor structure to form a first semiconductor structure and a first substrate. The recess penetrates through the first substrate and expose the one or more first trace. Thereafter, an input/output pad is formed in the recess and on the one or more first trace.Type: ApplicationFiled: September 13, 2021Publication date: December 30, 2021Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: He Chen, Zi Qun Hua, Shu Wu, Yong Qing Wang, Liang Xiao
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Patent number: 11205619Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. At least one first interconnect is a first dummy interconnect. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. At least one second interconnect is a second dummy interconnect. The second semiconductor structure further includes a second bonding layer including second bonding contacts. Each second interconnect is in contact with a respective second bonding contact. The semiconductor device further includes a bonding interface between the first and second bonding layers.Type: GrantFiled: July 8, 2020Date of Patent: December 21, 2021Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen, Zi Qun Hua
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Patent number: 11049834Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. The second semiconductor structure further includes a second bonding layer including second bonding contacts. At least one second bonding contact is in contact with a respective second interconnect. At least another second bonding contact is separated from the second interconnects. The semiconductor device further includes a bonding interface between the first and second bonding layers.Type: GrantFiled: March 4, 2019Date of Patent: June 29, 2021Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen, Zi Qun Hua
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Publication number: 20210183765Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a method for forming a 3D memory device is disclosed. A structure extending vertically through a memory stack including interleaved conductive layers and dielectric layers is formed above a substrate. A first dielectric layer is formed on the memory stack. An etch stop layer is formed on the first dielectric layer. A first contact is formed through the etch stop layer and the first dielectric layer and in contact with an upper end of the structure. A second dielectric layer is formed on the etch stop layer. A second contact is formed through the second dielectric layer and in contact with at least an upper end of the first contact.Type: ApplicationFiled: February 26, 2021Publication date: June 17, 2021Inventors: Hongbin Zhu, Juan Tang, Zi Qun Hua
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Publication number: 20210066274Abstract: A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a semiconductor structure and an input/output pad. The semiconductor structure includes a first substrate and a conductive layer, in which the first substrate has a first surface and a second surface opposite to each other, the conductive layer is disposed on the first surface of the first substrate, and the conductive layer includes one or more first trace. The first semiconductor structure has a recess penetrating the first substrate and exposing the one or more first trace, and the input/output pad is disposed on the one or more first trace and in the recess.Type: ApplicationFiled: October 8, 2019Publication date: March 4, 2021Inventors: He Chen, Zi Qun Hua, Shu Wu, Yong Qing Wang, Liang Xiao
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Publication number: 20210035941Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first interconnect layer including first interconnects is formed above a first substrate. A first bonding layer including first bonding contacts is formed above the first interconnect layer, such that each first interconnect is in contact with a respective first bonding contact. A second interconnect layer including second interconnects is formed above a second substrate. A second bonding layer including second bonding contacts is formed above the second interconnect layer, such that at least one second bonding contact is in contact with a respective second interconnect, and at least another second bonding contact is separated from the second interconnects. The first and second substrates are bonded in a face-to-face manner, such that each first bonding contact is in contact with one second bonding contact at a bonding interface.Type: ApplicationFiled: October 6, 2020Publication date: February 4, 2021Inventors: Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen, Zi Qun Hua
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Publication number: 20210020566Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate, a memory stack including interleaved conductive layers and dielectric layers above the substrate, a structure extending vertically through the memory stack, a first dielectric layer on the memory stack, an etch stop layer on the first dielectric layer, a second dielectric layer on the etch stop layer, a first contact through the etch stop layer and the first dielectric layer and in contact with an upper end of the structure, and a second contact through the second dielectric layer and in contact with at least an upper end of the first contact.Type: ApplicationFiled: September 19, 2019Publication date: January 21, 2021Inventors: Hongbin Zhu, Juan Tang, Zi Qun Hua
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Publication number: 20200381384Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first device layer is formed above a first substrate. A first bonding layer including a first bonding contact is formed above the first device layer. The first bonding contact is made of a first indiffusible conductive material. A second device layer is formed above a second substrate. A second bonding layer including a second bonding contact is formed above the second device layer. The first substrate and the second substrate are bonded in a face-to-face manner, such that the first bonding contact is in contact with the second bonding contact at a bonding interface.Type: ApplicationFiled: August 18, 2020Publication date: December 3, 2020Inventors: Zongliang Huo, Jun Liu, Jifeng Zhu, Jun Chen, Zi Qun Hua, Li Hong Xiao
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Patent number: 10840125Abstract: The present invention relates to a memory structure and a method for forming the same. The memory structure includes a first substrate and an isolation structure. The first substrate includes a substrate layer and a storage layer. The substrate layer has a first surface and a second surface opposite to the first surface. The storage layer is disposed on the first surface of the substrate layer. The substrate layer has a doped well. The isolation structure penetrates through the substrate layer and is disposed at an edge of the doped well for isolating the doped well and the peripheral substrate layer. The memory structure can avoid current leakage between the doped well and the substrate layer so as to improve the performance.Type: GrantFiled: September 10, 2018Date of Patent: November 17, 2020Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: Jin Wen Dong, Jun Chen, Zhiliang Xia, Zi Qun Hua, Jifeng Zhu, He Chen