Abstract: An electronic device includes: a system board; a load, located on the first side of the system board and including a power supply region, the power supply region includes load pins arranged in a plurality of rows and in a plurality of columns; and at least one column of output capacitors, located on the second side of the system board along a third direction; at least one row of the load pins is a first arrangement row, the first arrangement row includes a plurality of load pin groups arranged sequentially along the second direction, each of the load pin groups includes at least two load pins of a same polarity; and two ends of a vertical projection of each column of the output capacitors on the power supply region are located at two sides of a centerline, in the third direction, of at least one first position pin.

Abstract: The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.

Abstract: The present disclosure provides a circuit module and a solid-state transformer system. The circuit module includes: a first circuit unit outputting a first voltage; a second circuit unit outputting a second voltage, where the second voltage is less than the first voltage; and a shielding structure arranged between the first circuit unit and the second circuit unit, where the shielding structure includes: a first conductor layer electrically coupled to the first circuit unit, a second conductor layer electrically coupled to the second circuit unit, a third conductor layer located between the first conductor layer and the second conductor layer; a first insulation layer arranged between the first conductor layer and the third conductor layer; and a second insulation layer arranged between the second conductor layer and the third conductor layer.

Abstract: The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

Abstract: The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

Abstract: The present disclosure provides a power converter, including: a pre-stage circuit, configured to receive an input voltage and convert the input voltage to a bus voltage; and plurality of post-stage circuits, connected in parallel to an output terminal of the pre-stage circuit, and configured to receive the bus voltage from the pre-stage circuit and each converts the bus voltage to an output voltage. The power converter provided by the present disclosure can effectively solve the problems of isolation and the wide range of operating voltage, and can take both of high efficiency and high power density into consideration.

Abstract: The present disclosure provides a via structure and a multilayer circuit board including the via structure. The via structure is provided in three or more conductor layers in the same electrical network, the conductor layers overlapping with each other vertically and including at least one current input layer and at least one current output layer; wherein the via structure includes a plurality of rows of vias, each row of vias puncture through at least one current input layer and at least one current output layer, and a part of the rows of vias puncture through all of the conductor layers, and the other part of the rows of vias puncture through a part of the conductor layers. By using the via structure in the present disclosure, the vias are subject to even temperature and thus the lifetime of the circuit board is extended.

Abstract: The present disclosure generally relates to a test method and system thereof. The test method comprises: outputting a test control signal to a test power supply of the circuit under test so as to adjust an input signal of the circuit under test so that a gain range of the circuit under test in an abnormal operating state is the same as that of the circuit under test in a normal operating state when the circuit under test enters into the abnormal operating state. The present disclosure may meet requirements for equipment test without sacrificing the efficiency of circuits in normal operating state or adding complexity circuit.

Abstract: The present disclosure provides a via structure and a multilayer circuit board including the via structure. The via structure is provided in three or more conductor layers in the same electrical network, the conductor layers overlapping with each other vertically and including at least one current input layer and at least one current output layer; wherein the via structure includes a plurality of rows of vias, each row of vias puncture through at least one current input layer and at least one current output layer, and a part of the rows of vias puncture through all of the conductor layers, and the other part of the rows of vias puncture through a part of the conductor layers. By using the via structure in the present disclosure, the vias are subject to even temperature and thus the lifetime of the circuit board is extended.

Abstract: The present disclosure provides a power converter, including: a pre-stage circuit, configured to receive an input voltage and convert the input voltage to a bus voltage; and plurality of post-stage circuits, connected in parallel to an output terminal of the pre-stage circuit, and configured to receive the bus voltage from the pre-stage circuit and each converts the bus voltage to an output voltage. The power converter provided by the present disclosure can effectively solve the problems of isolation and the wide range of operating voltage, and can take both of high efficiency and high power density into consideration.

Abstract: The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; and a first power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the circuit board, the chip and the first power converting module are stacked to form the assembly structure. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

Abstract: The present disclosure generally relates to a test method and system thereof. The test method comprises: outputting a test control signal to a test power supply of the circuit under test so as to adjust an input signal of the circuit under test so that a gain range of the circuit under test in an abnormal operating state is the same as that of the circuit under test in a normal operating state when the circuit under test enters into the abnormal operating state. The present disclosure may meet requirements for equipment test without sacrificing the efficiency of circuits in normal operating state or adding complexity circuit.

Abstract: A multi-phase switching power conversion circuit has at least three phases and includes a plurality of switching circuits, a plurality of transformers, a plurality of output rectifier circuits, a resonant network and a control circuit. The resonant network includes a plurality of symmetrical terminals and a plurality of phase branches, which are connected in a multi-phase symmetrical relationship. Each of the symmetrical terminals is connected to the output side of respective switching circuits. The phase branches are connected to a resonant common terminal such that the phase branches are in a star connection. The resonant common terminal is different from the positive terminal and the first reference terminal of the input voltage source. The control circuit is connected to an output terminal of the multi-phase switching power conversion circuit and a plurality of the control terminals of the plurality of switching circuits.

Abstract: A multi-phase switching power conversion circuit has at least three phases and includes a plurality of switching circuits, a plurality of transformers, a plurality of output rectifier circuits, a resonant network and a control circuit. The resonant network includes a plurality of symmetrical terminals and a plurality of phase branches, which are connected in a multi-phase symmetrical relationship. Each of the symmetrical terminals is connected to the output side of respective switching circuits. The phase branches are connected to a resonant common terminal such that the phase branches are in a star connection. The resonant common terminal is different from the positive terminal and the first reference terminal of the input voltage source. The control circuit is connected to an output terminal of the multi-phase switching power conversion circuit and a plurality of the control terminals of the plurality of switching circuits.

Abstract: The present invention discloses a transformer structure. The transformer structure comprises a first primary winding, and a first secondary circuits. The first secondary circuits comprises a filtering capacitor, a conductive Cu windings and a rectifier configured onto the printed circuit board (PCB) forming the first secondary circuits PCB winding. The first primary winding and the secondary circuits are interleaved with each other.

Abstract: The present invention discloses a transformer structure. The transformer structure comprises a first primary winding, and a first secondary circuits. The first secondary circuits comprises a filtering capacitor, a conductive Cu windings and a rectifier configured onto the printed circuit board (PCB) forming the first secondary circuits PCB winding. The first primary winding and the secondary circuits are interleaved with each other.