Patents by Inventor Zidong Lin

Zidong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems for providing thermal management to integrated circuits
    Patent number: 11810836
    Abstract: A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a first heatsink thermally conductively coupled to the first vapor chamber; and a second thermal management device, that includes a second vapor chamber; and a second heatsink thermally conductively coupled to the second vapor chamber, where the second thermal management device is thermally conductively coupled to the first thermal management device; where the PCB is interposed between the first thermal management device and the second thermal management device.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: November 7, 2023
    Assignee: Arista Networks, Inc.
    Inventors: Tiffany Doria, Robert Morris Wilcox, Richard Neville Hibbs, Tiong Khai Soo, Ernest M. Thurlow, Zidong Lin
  • PLAYPEN CONNECTING JOINT AND PLAYPEN
    Publication number: 20230284795
    Abstract: The invention discloses a playpen connecting joint and a playpen. The playpen connecting joint comprises a shell, a locking piece, a cover plate and a horizontal pipe connector. The locking piece is actuated through the cooperation of a lock catch and a push switch, so as to realize free rotation and fixation of the horizontal pipe connector, so that the playpen adopting the playpen connecting joint can realize free adjustment of the enclosure shape, and is stable in structure and easy to operate in use.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 14, 2023
    Inventors: Zidong Lin, Gengjia Yang
  • SYSTEMS FOR PROVIDING THERMAL MANAGEMENT TO INTEGRATED CIRCUITS
    Publication number: 20210384104
    Abstract: A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a first heatsink thermally conductively coupled to the first vapor chamber; and a second thermal management device, that includes a second vapor chamber; and a second heatsink thermally conductively coupled to the second vapor chamber, where the second thermal management device is thermally conductively coupled to the first thermal management device; where the PCB is interposed between the first thermal management device and the second thermal management device.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 9, 2021
    Inventors: Tiffany Doria, Robert Morris Wilcox, Richard Neville Hibbs, Tiong Khai Soo, Ernest M. Thurlow, Zidong Lin
  • Baby playpen
    Patent number: D1019160
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: March 26, 2024
    Inventor: Zidong Lin