Abstract: A method and apparatus cast a material with nano-micro duplex grain structure. The apparatus includes module system, heating system casting mold and gating system, multiaxial compound motion system accompanied by the following technological characteristics; alloy smelting; after heat preservation, alloy melt is poured into the casting mold which is put into the centrifugal barrel of the six-axis motion system; then the casting mold carries out composite motion and the alloy melt starts solidification; as a result, casting Al—Si alloy block with multi-scale nano-structure includes nano-micro duplex grain group is prepared.

Abstract: A method and apparatus casts a material with nano-micro duplex grain structure. The apparatus is comprised of module system, heating system, casting mold and gating system, multiaxial compound motion system accompanied by the following technological characteristics; alloy smelting; after heat preservation, alloy melt are poured into the casting mold which is put into the centrifugal barrel of the six-axis motion system; then the casting mold carries out composite motion and the alloy melt starts solidification; as a result, casting Al—Si alloy block with multi-scale nano-structure comprising of nano-micro duplex grain group are prepared. The advantages of the present invention includes that multi-scale casting nano-structure with nano-micro duplex grain group are obtained because of the composite shear flow field generated in the alloy melt.

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, to a substrate are provided. Also provided are methods of improving the adhesion of coating compositions to a substrate.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Abstract: Embodiments of a method for nucleic acid-mediated control of a nanoparticle shape are disclosed. In some embodiments, one or more nucleic acid oligomers are adsorbed to a metal nanoseed, and additional metal is deposited onto the nanoseed to produce a shaped nanoparticle. In certain embodiments, the nanoseed is gold and the oligomers are 5-100 nucleotides in length. The nanoparticle shape is determined at least in part by the nucleic acid sequence of the oligomer(s). Shaped nanoparticles produced by embodiments of the method include nanoflowers, nanospheres, nanostars, and nanoplates. Embodiments for using the shaped nanoparticles also are disclosed.

Abstract: The present invention provides a sensor for detecting mercury, comprising: a first polynucleotide, comprising a first region, and a second region, a second polynucleotide, a third polynucleotide, a fluorophore, and a quencher, wherein the third polynucleotide is optionally linked to the second region; the fluorophore is linked to the first polynucleotide and the quencher is linked to the second polynucleotide, or the fluorophore is linked to the second polynucleotide and the quencher is linked to the first polynucleotide; the first region and the second region hybridize to the second polynucleotide; and the second region binds to the third polynucleotide in the presence of Hg2+ ions.