Patents by Inventor Zien FU

Zien FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11802229
    Abstract: A low-modulus high-adhesion silane-modified polyether sealant for prefabricated buildings is provided by including a composition A and a composition B, wherein the composition A includes silane-modified polyether, plasticizer, hydroxy-terminated branched polyether, branched polyether epoxy resin, coupling agent, thixotropic agent, silica, reinforcing filler A, hollow glass microspheres and toner, and the composition B includes plasticizer, hydroxy-terminated branched polyether, light stabilizer, reinforcing filler B, organotin catalyst and amine curing agent. The present disclosure also optimized the various ingredients in the silane-modified polyether sealant, and a formulation of sealant having the best bonding effect was obtained.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: October 31, 2023
    Assignee: GUANGZHOU BAIYUN CHEMICAL INDUSTRY CO., LTD.
    Inventors: Jianjun Chen, Zien Fu, Hengchao Huang, Yangqing Chen, Fei Long, Suhan Yang, Guanghua Liu
  • Publication number: 20210163803
    Abstract: A low-modulus high-adhesion silane-modified polyether sealant for prefabricated buildings is provided by including a composition A and a composition B, wherein the composition A includes silane-modified polyether, plasticizer, hydroxy-terminated branched polyether, branched polyether epoxy resin, coupling agent, thixotropic agent, silica, reinforcing filler A, hollow glass microspheres and toner, and the composition B includes plasticizer, hydroxy-terminated branched polyether, light stabilizer, reinforcing filler B, organotin catalyst and amine curing agent. The present disclosure also optimized the various ingredients in the silane-modified polyether sealant, and a formulation of sealant having the best bonding effect was obtained.
    Type: Application
    Filed: December 28, 2017
    Publication date: June 3, 2021
    Inventors: Jianjun CHEN, Zien FU, Hengchao HUANG, Yangqing CHEN, Fei LONG, Suhan YANG, Guanghua LIU