Abstract: A spinal implant assembly, a kit for forming same and a method for forming same. The spinal implant assembly comprises: a first endplate having a first non-planar inner surface; a second endplate having a second non-planar inner surface facing toward the first non-planar inner surface; at least one fastener attaching the first endplate and the second endplate to one another; and a layer including a piezoelectric material (piezoelectric layer), the piezoelectric layer between the first non-planar inner surface and the second non-planar inner surface and having a non-planar upper surface facing toward the first non-planar inner surface and a non-planar lower surface facing toward the second non-planar inner surface, wherein, at a front region of the spinal implant assembly, the first non-planar inner surface and the second non-planar inner surface define a vertically biased interface.

Abstract: An orthopedic implant assembly includes a bone plate configured to couple the implant assembly to a fractured bone. A piezoelectric component is disposed on the bone plate and configured to produce an electrical output corresponding to a load the piezoelectric component is subjected to. When the implant is in contact with the fractured bone the electrical output is transmitted to the fractured bone.

Abstract: A spinal implant capable of generating an electric output includes a first endplate, a second endplate, and a piezoelectric component disposed between the first and second endplates. The spinal implant may further include an intermediate body and a second piezoelectric component disposed between the intermediate body and the second endplate. The inner surfaces of the endplates and/or the intermediate body may be non-planar, such as having an undulating shape. The electric output is produced when the endplates of the spinal implant undergo a force, including a compressive force and/or a shear force.