Patents by Inventor Zigmund Ramirez Camacho, Jr.

Zigmund Ramirez Camacho, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple flip-chip integrated circuit package system
    Patent number: 7977579
    Abstract: An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: July 12, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Henry D. Bathan, Zigmund Ramirez Camacho, Jr., Arnel Trasporto, Jeffrey D. Punzalan