Patents by Inventor Zih-Jie LIN

Zih-Jie LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Piezoelectric vibration module and haptic feedback module
    Patent number: 11650664
    Abstract: A piezoelectric vibration module has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board includes a plurality of cutting areas. Two adjacent cutting areas are spaced with a cut through groove. Each piezoelectric unit is respectively configured below each cutting area.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: May 16, 2023
    Assignee: CHUNG-YUAN CHRISTIAN UNIVERSITY
    Inventors: Yung Ting, Sheuan-Perng Lin, Jun-Hong Lin, Zih-Jie Lin
  • PIEZOELECTRIC VIBRATION MODULE AND HAPTIC FEEDBACK MODULE
    Publication number: 20210373666
    Abstract: A piezoelectric vibration module has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board includes a plurality of cutting areas. Two adjacent cutting areas are spaced with a cut through groove. Each piezoelectric unit is respectively configured below each cutting area.
    Type: Application
    Filed: November 19, 2020
    Publication date: December 2, 2021
    Inventors: Yung TING, Sheuan-Perng LIN, Jun-Hong LIN, Zih-Jie LIN