Patents by Inventor Zijun QIU

Zijun QIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Switch, switching system, switching network chip component, and forwarding chip component
    Patent number: 9716670
    Abstract: Disclosed are a switch, a switching system, a switching network chip component, and a forwarding chip component. The switch includes: a switching network chip component packaged as an independent device, a forwarding chip component packaged as an independent device, and a controller. The switching system includes at least one switch and at least two network devices connected to the switch. The switching network chip component includes: a first cartridge housing, a switching network chip, a first heat dissipation component, and a first power supply component arranged inside the first cartridge housing. The forwarding chip component includes: a second cartridge housing, a forwarding chip, a second heat dissipation component, and a second power supply component arranged inside the second cartridge housing.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: July 25, 2017
    Assignee: TENCENT TECHNOLOGY (Shenzhen) COMPANY LIMITED
    Inventor: Zijun Qiu
  • SWITCH, SWITCHING SYSTEM, SWITCHING NETWORK CHIP COMPONENT, AND FORWARDING CHIP COMPONENT
    Publication number: 20160065500
    Abstract: Disclosed are a switch, a switching system, a switching network chip component, and a forwarding chip component. The switch includes: a switching network chip component packaged as an independent device, a forwarding chip component packaged as an independent device, and a controller. The switching system includes at least one switch and at least two network devices connected to the switch. The switching network chip component includes: a first cartridge housing, a switching network chip, a first heat dissipation component, and a first power supply component arranged inside the first cartridge housing. The forwarding chip component includes: a second cartridge housing, a forwarding chip, a second heat dissipation component, and a second power supply component arranged inside the second cartridge housing.
    Type: Application
    Filed: September 1, 2015
    Publication date: March 3, 2016
    Inventor: Zijun QIU