Patents by Inventor Ziliang CAI
Ziliang CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11682878Abstract: The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.Type: GrantFiled: August 6, 2020Date of Patent: June 20, 2023Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, John Cheng, Ziliang Cai
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Publication number: 20230188241Abstract: The present disclosure is generally directed to a holder that can be used to couple to and optically align an optical component with, for instance, an associated light path to launch or receive optical channel wavelengths along the same. The holder preferably includes a receptacle to couple to the optical component and a mounting section enables the holder to be securely coupled to a substrate in a manner that minimizes or otherwise reduces introducing component shift and resulting optical misalignment.Type: ApplicationFiled: December 15, 2021Publication date: June 15, 2023Inventors: Kai-Sheng LIN, Hao-Chiang CHENG, Ziliang CAI
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Patent number: 11474311Abstract: A parabolic reflector device (also referred to herein as a parabolic lens device) is disclosed which includes a plurality of parabolic lens members and a mirror member which couple together and collectively provide a light-transmissive structure for multiplexing or demultiplexing of an optical signal. The parabolic reflector device can be implemented within optical subassembly modules to support operations of transmitter optical subassemblies (TOSAs) and/or receiver optical subassemblies (ROSAs).Type: GrantFiled: May 27, 2021Date of Patent: October 18, 2022Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
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Patent number: 11320601Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.Type: GrantFiled: September 24, 2020Date of Patent: May 3, 2022Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, John Cheng, Ziliang Cai
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Patent number: 11320598Abstract: The present disclosure is generally directed to an optical demultiplexer for use in an optical transceiver module having a truncated profile/shape to increase tolerance and accommodate adjacent optical components. In more detail, the optical demultiplexer comprises a body with at least one truncated corner at the input end. The at least one truncated corner allows the optical demultiplexer to be disposed/mounted, e.g., directly, on a densely populated transceiver substrate, e.g., a printed circuit board (PBC), and provide additional tolerance/space for mounting of circuitry and/or components within the region that would normally be occupied by corner(s) of the optical demultiplexer body. The at least one truncated corner may be introduced in a post-production step, e.g., via cut & polishing, or introduced during formation of the optical demultiplexer using, for instance, photolithography techniques.Type: GrantFiled: November 24, 2019Date of Patent: May 3, 2022Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
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Publication number: 20220091345Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.Type: ApplicationFiled: September 24, 2020Publication date: March 24, 2022Inventors: Kai-Sheng LIN, John CHENG, Ziliang CAI
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Publication number: 20220091350Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.Type: ApplicationFiled: September 24, 2020Publication date: March 24, 2022Inventors: Kai-Sheng LIN, John CHENG, Ziliang CAI
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Publication number: 20220045472Abstract: The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.Type: ApplicationFiled: August 6, 2020Publication date: February 10, 2022Inventors: Kai-Sheng LIN, John CHENG, Ziliang CAI
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Patent number: 11146039Abstract: A temperature controlled multi-channel transmitter optical subassembly (TOSA), consistent with embodiments described herein, may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers to emit a plurality of different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers such that the amount of heat communicated to each laser is substantially the same. The global temperature may be established, at least in part, by monitoring the shortest channel wavelength and/or a temperature of the lasers. The temperature of the lasers may then get increased via a shared heating device in thermal communication with the lasers until the shortest monitored wavelength substantially reaches the nominal shortest wavelength or the measured temperature substantially equals the global temperature.Type: GrantFiled: May 22, 2019Date of Patent: October 12, 2021Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, Hsiu-Che Wang, Ziliang Cai
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Patent number: 11054592Abstract: The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.Type: GrantFiled: November 24, 2019Date of Patent: July 6, 2021Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
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Publication number: 20210157074Abstract: The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.Type: ApplicationFiled: November 24, 2019Publication date: May 27, 2021Inventors: Kai-Sheng LIN, Hao-Chiang CHENG, Ziliang CAI
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Publication number: 20210157058Abstract: The present disclosure is generally directed to an optical demultiplexer for use in an optical transceiver module having a truncated profile/shape to increase tolerance and accommodate adjacent optical components. In more detail, the optical demultiplexer comprises a body with at least one truncated corner at the input end. The at least one truncated corner allows the optical demultiplexer to be disposed/mounted, e.g., directly, on a densely populated transceiver substrate, e.g., a printed circuit board (PBC), and provide additional tolerance/space for mounting of circuitry and/or components within the region that would normally be occupied by corner(s) of the optical demultiplexer body. The at least one truncated corner may be introduced in a post-production step, e.g., via cut & polishing, or introduced during formation of the optical demultiplexer using, for instance, photolithography techniques.Type: ApplicationFiled: November 24, 2019Publication date: May 27, 2021Inventors: Kai-Sheng LIN, Hao-Chiang CHENG, Ziliang CAI
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Patent number: 10928600Abstract: The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.Type: GrantFiled: October 25, 2019Date of Patent: February 23, 2021Assignee: Applied Optoelectronics, Inc.Inventors: Kevin Liu, Kai-Sheng Lin, Ziliang Cai
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Patent number: 10859775Abstract: In general, the present disclosure is directed to an optical turning mirror for receiving channel wavelengths along a first optical path and reflecting the same towards a fiber or photodetector (PD) without the necessity of disposing a highly reflective layer to increase reflectivity. In more detail, the optical turning mirror includes a substantially transparent body, e.g., capable of passing at least 80% of incident wavelengths, that defines an input region with integrated focus lens(es) for receiving channel wavelengths along a first optical path and a reflective surface disposed opposite the input region to direct/launch received channel wavelengths along a second optical path towards an output interface having an angled light-transmissive surface, with the second optical path extending substantially transverse relative to the first optical path.Type: GrantFiled: September 5, 2019Date of Patent: December 8, 2020Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, Ziliang Cai, Hao-Chiang Cheng
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Publication number: 20200373737Abstract: A temperature controlled multi-channel transmitter optical subassembly (TOSA), consistent with embodiments described herein, may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers to emit a plurality of different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers such that the amount of heat communicated to each laser is substantially the same. The global temperature may be established, at least in part, by monitoring the shortest channel wavelength and/or a temperature of the lasers. The temperature of the lasers may then get increased via a shared heating device in thermal communication with the lasers until the shortest monitored wavelength substantially reaches the nominal shortest wavelength or the measured temperature substantially equals the global temperature.Type: ApplicationFiled: May 22, 2019Publication date: November 26, 2020Inventors: Kai-Sheng LIN, Hsiu-Che WANG, Ziliang CAI
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Patent number: 10788690Abstract: This present disclosure is generally directed to an optical isolator array with a magnetic base that allows for mounting and alignment of N number of optical isolators modules within an optical subassembly module. In an embodiment, the magnetic base provides at least one mounting surface for coupling to N number of optical isolators, with N being equal to an optical channel count for the optical subassembly (e.g., 4-channels, 8-channels, and so on). The magnetic base includes an overall width that allows for a desired number of optical isolators to get mounted thereon. Each optical isolator can be uniformly disposed along the same axis on the magnetic base and at a distance D from adjacent optical isolators. An adhesive such as ultraviolet-curing (UV-curing) optical adhesives may be used to secure each optical isolator at a predefined position and increase overall structural integrity.Type: GrantFiled: January 25, 2019Date of Patent: September 29, 2020Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, Kevin Liu, Ziliang Cai
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Publication number: 20200285007Abstract: The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.Type: ApplicationFiled: October 25, 2019Publication date: September 10, 2020Inventors: Kevin LIU, Kai-Sheng LIN, Ziliang CAI
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Publication number: 20200241334Abstract: This present disclosure is generally directed to an optical isolator array with a magnetic base that allows for mounting and alignment of N number of optical isolators modules within an optical subassembly module. In an embodiment, the magnetic base provides at least one mounting surface for coupling to N number of optical isolators, with N being equal to an optical channel count for the optical subassembly (e.g., 4-channels, 8-channels, and so on). The magnetic base includes an overall width that allows for a desired number of optical isolators to get mounted thereon. Each optical isolator can be uniformly disposed along the same axis on the magnetic base and at a distance D from adjacent optical isolators. An adhesive such as ultraviolet-curing (UV-curing) optical adhesives may be used to secure each optical isolator at a predefined position and increase overall structural integrity.Type: ApplicationFiled: January 25, 2019Publication date: July 30, 2020Inventors: Kai-Sheng LIN, Kevin Liu, Ziliang Cai
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Publication number: 20200218018Abstract: The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.Type: ApplicationFiled: January 3, 2019Publication date: July 9, 2020Inventors: Kai-Sheng LIN, Yi WANG, Ziliang CAI
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Patent number: 10698168Abstract: The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.Type: GrantFiled: January 3, 2019Date of Patent: June 30, 2020Assignee: Applied Optoelectronics, Inc.Inventors: Kai-Sheng Lin, Yi Wang, Ziliang Cai