Patents by Inventor Zilong DENG

Zilong DENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
    Publication number: 20180035028
    Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
    Type: Application
    Filed: February 22, 2017
    Publication date: February 1, 2018
    Inventors: Mingzhu WANG, Zhenyu CHEN, Nan GUO, Takehiko TANAKA, Bojie ZHAO, Zilong DENG
  • Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
    Publication number: 20180035022
    Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.
    Type: Application
    Filed: March 16, 2017
    Publication date: February 1, 2018
    Inventors: Mingzhu WANG, Zhenyu CHEN, Nan GUO, Takehiko TANAKA, Bojie ZHAO, Zilong DENG
  • Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
    Publication number: 20180007244
    Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
    Type: Application
    Filed: March 29, 2017
    Publication date: January 4, 2018
    Inventors: Mingzhu WANG, Zhenyu CHEN, Takehiko TANAKA, Zhongyu LUAN, Bojie ZHAO, Zhen HUANG, Nan GUO, Fengsheng XI, Heng JIANG, Zilong DENG