Patents by Inventor Zilu Weng
Zilu Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230223281Abstract: A wafer chuck assembly includes a puck, a shaft and a base. The puck includes an electrically insulating material that defines a top surface of the puck; a plurality of electrodes are embedded within the electrically insulating material. The puck also includes an inner puck element that forms one or more channels for a heat exchange fluid, the inner puck element being in thermal communication with the electrically insulating material, and an electrically conductive plate disposed proximate to the inner puck element. The shaft includes an electrically conductive shaft housing that is electrically coupled with the plate, and a plurality of connectors, including electrical connectors for the electrodes. The base includes an electrically conductive base housing that is electrically coupled with the shaft housing, and an electrically insulating terminal block disposed within the base housing, the plurality of connectors passing through the terminal block.Type: ApplicationFiled: February 27, 2023Publication date: July 13, 2023Applicant: Applied Materials, Inc.Inventors: Toan Q. Tran, Zilu Weng, Dmitry Lubomirsky, Satoru Kobayashi, Tae Seung Cho, Soonam Park, Son M. Phi, Shankar Venkataraman
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Patent number: 11594428Abstract: A wafer chuck assembly includes a puck, a shaft and a base. The puck includes an electrically insulating material that defines a top surface of the puck; a plurality of electrodes are embedded within the electrically insulating material. The puck also includes an inner puck element that forms one or more channels for a heat exchange fluid, the inner puck element being in thermal communication with the electrically insulating material, and an electrically conductive plate disposed proximate to the inner puck element. The shaft includes an electrically conductive shaft housing that is electrically coupled with the plate, and a plurality of connectors, including electrical connectors for the electrodes. The base includes an electrically conductive base housing that is electrically coupled with the shaft housing, and an electrically insulating terminal block disposed within the base housing, the plurality of connectors passing through the terminal block.Type: GrantFiled: April 28, 2017Date of Patent: February 28, 2023Assignee: Applied Materials, Inc.Inventors: Toan Q. Tran, Zilu Weng, Dmitry Lubomirsky, Satoru Kobayashi, Tae Seung Cho, Soonam Park, Son M. Phi, Shankar Venkataraman
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Patent number: 11476093Abstract: An apparatus for plasma processing includes a first plasma source, a first planar electrode, a gas distribution device, a plasma blocking screen and a workpiece chuck. The first plasma source produces first plasma products that pass, away from the first plasma source, through first apertures in the first planar electrode. The first plasma products continue through second apertures in the gas distribution device. The plasma blocking screen includes a third plate with fourth apertures, and faces the gas distribution device such that the first plasma products pass through the plurality of fourth apertures. The workpiece chuck faces the second side of the plasma blocking screen, defining a process chamber between the plasma blocking screen and the workpiece chuck. The fourth apertures are of a sufficiently small size to block a plasma generated in the process chamber from reaching the gas distribution device.Type: GrantFiled: December 5, 2019Date of Patent: October 18, 2022Assignee: Applied Materials, Inc.Inventors: Toan Q. Tran, Soonam Park, Zilu Weng, Dmitry Lubomirsky
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Publication number: 20200111643Abstract: An apparatus for plasma processing includes a first plasma source, a first planar electrode, a gas distribution device, a plasma blocking screen and a workpiece chuck. The first plasma source produces first plasma products that pass, away from the first plasma source, through first apertures in the first planar electrode. The first plasma products continue through second apertures in the gas distribution device. The plasma blocking screen includes a third plate with fourth apertures, and faces the gas distribution device such that the first plasma products pass through the plurality of fourth apertures. The workpiece chuck faces the second side of the plasma blocking screen, defining a process chamber between the plasma blocking screen and the workpiece chuck. The fourth apertures are of a sufficiently small size to block a plasma generated in the process chamber from reaching the gas distribution device.Type: ApplicationFiled: December 5, 2019Publication date: April 9, 2020Applicant: Applied Materials, Inc.Inventors: Toan Q. Tran, Soonam Park, Zilu Weng, Dmitry Lubomirsky
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Patent number: 10504700Abstract: An apparatus for plasma processing includes a first plasma source, a first planar electrode, a gas distribution device, a plasma blocking screen and a workpiece chuck. The first plasma source produces first plasma products that pass, away from the first plasma source, through first apertures in the first planar electrode. The first plasma products continue through second apertures in the gas distribution device. The plasma blocking screen includes a third plate with fourth apertures, and faces the gas distribution device such that the first plasma products pass through the plurality of fourth apertures. The workpiece chuck faces the second side of the plasma blocking screen, defining a process chamber between the plasma blocking screen and the workpiece chuck. The fourth apertures are of a sufficiently small size to block a plasma generated in the process chamber from reaching the gas distribution device.Type: GrantFiled: August 27, 2015Date of Patent: December 10, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Toan Q. Tran, Soonam Park, Zilu Weng, Dmitry Lubomirsky
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Publication number: 20170229326Abstract: A wafer chuck assembly includes a puck, a shaft and a base. The puck includes an electrically insulating material that defines a top surface of the puck; a plurality of electrodes are embedded within the electrically insulating material. The puck also includes an inner puck element that forms one or more channels for a heat exchange fluid, the inner puck element being in thermal communication with the electrically insulating material, and an electrically conductive plate disposed proximate to the inner puck element. The shaft includes an electrically conductive shaft housing that is electrically coupled with the plate, and a plurality of connectors, including electrical connectors for the electrodes. The base includes an electrically conductive base housing that is electrically coupled with the shaft housing, and an electrically insulating terminal block disposed within the base housing, the plurality of connectors passing through the terminal block.Type: ApplicationFiled: April 28, 2017Publication date: August 10, 2017Applicant: Applied Materials, Inc.Inventors: Toan Q. Tran, Zilu Weng, Dmitry Lubomirsky, Satoru Kobayashi, Tae Seung Cho, Soonam Park, Son M. Phi, Shankar Venkataraman
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Publication number: 20170062184Abstract: An apparatus for plasma processing includes a first plasma source, a first planar electrode, a gas distribution device, a plasma blocking screen and a workpiece chuck. The first plasma source produces first plasma products that pass, away from the first plasma source, through first apertures in the first planar electrode. The first plasma products continue through second apertures in the gas distribution device. The plasma blocking screen includes a third plate with fourth apertures, and faces the gas distribution device such that the first plasma products pass through the plurality of fourth apertures. The workpiece chuck faces the second side of the plasma blocking screen, defining a process chamber between the plasma blocking screen and the workpiece chuck. The fourth apertures are of a sufficiently small size to block a plasma generated in the process chamber from reaching the gas distribution device.Type: ApplicationFiled: August 27, 2015Publication date: March 2, 2017Applicant: APPLIED MATERIALS, INC.Inventors: Toan Q. Tran, Soonam Park, Zilu Weng, Dmitry Lubomirsky
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Publication number: 20160225652Abstract: A wafer chuck assembly includes a puck, a shaft and a base. The puck includes an electrically insulating material that defines a top surface of the puck; a plurality of electrodes are embedded within the electrically insulating material. The puck also includes an inner puck element that forms one or more channels for a heat exchange fluid, the inner puck element being in thermal communication with the electrically insulating material, and an electrically conductive plate disposed proximate to the inner puck element. The shaft includes an electrically conductive shaft housing that is electrically coupled with the plate, and a plurality of connectors, including electrical connectors for the electrodes. The base includes an electrically conductive base housing that is electrically coupled with the shaft housing, and an electrically insulating terminal block disposed within the base housing, the plurality of connectors passing through the terminal block.Type: ApplicationFiled: February 3, 2015Publication date: August 4, 2016Applicant: Applied Materials, Inc.Inventors: Toan Q. Tran, Zilu Weng, Dmitry Lubomirsky, Satoru Kobayashi, Tae Seung Cho, Soonam Park, Son M. Phi, Shankar Venkataraman