Abstract: The invention provides a yield rate prediction method for manufacture of integrated circuit wafers, which includes the following steps: obtaining candidate reference product models; obtaining parameters of the candidate reference products; obtaining functions of candidate reference products; predicting candidate reference products; selecting a final reference product; obtaining a new product prediction model; and predicting yield rate of new product. The yield rate prediction method for manufacture of integrated circuit wafer provided by the disclosure is performed based on the functional relationship between random defect density and yield rate in wafer manufacturing. By referring to the yield rate data of mature products on the production line, establishing data model and performing regression analysis, a more accurate yield rate prediction value of a new product can be obtained, thus providing a new product yield rate prediction method for manufacture of semiconductor integrated circuit wafers.