Patents by Inventor Zin O YOO

Zin O YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate, manufacturing method thereof, and mold therefor
    Patent number: 9064882
    Abstract: There are provided a package substrate, a manufacturing method thereof, and a mold therefor. The method of manufacturing a package substrate includes: preparing a chip component and a substrate; mounting the chip component on a main surface of the substrate; preparing a mold having a cavity and protrusions formed on a ceiling surface thereof; disposing the substrate on a bottom surface of the mold such that the chip component is positioned within the cavity; and forming a resin sealing body that collectively hermetically seals the chip component and the main surface of the substrate by injecting a pressurized liquid resin into the cavity.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: June 23, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Zin O Yoo
  • PACKAGE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND MOLD THEREFOR
    Publication number: 20140048960
    Abstract: There are provided a package substrate, a manufacturing method thereof, and a mold therefor. The method of manufacturing a package substrate includes: preparing a chip component and a substrate; mounting the chip component on a main surface of the substrate; preparing a mold having a cavity and protrusions formed on a ceiling surface thereof; disposing the substrate on a bottom surface of the mold such that the chip component is positioned within the cavity; and forming a resin sealing body that collectively hermetically seals the chip component and the main surface of the substrate by injecting a pressurized liquid resin into the cavity.
    Type: Application
    Filed: March 14, 2013
    Publication date: February 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Zin O YOO