Patents by Inventor Zink Wei

Zink Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical Mechanical Planarization Tool
    Publication number: 20230321789
    Abstract: A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.
    Type: Application
    Filed: June 14, 2023
    Publication date: October 12, 2023
    Inventors: Tung-Kai Chen, Shang-Yu Wang, Wan-Chun Pan, Zink Wei, Hui-Chi Huang, Kei-Wei Chen
  • Chemical mechanical planarization tool
    Patent number: 11712778
    Abstract: A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: August 1, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tung-Kai Chen, Shang-Yu Wang, Wan-Chun Pan, Zink Wei, Hui-Chi Huang, Kei-Wei Chen
  • CHEMICAL MECHANICAL PLANARIZATION TOOL
    Publication number: 20210053184
    Abstract: A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Inventors: Tung-Kai Chen, Shang-Yu Wang, Wan-Chun Pan, Zink Wei, Hui-Chi Huang, Kei-Wei Chen