Abstract: This invention relates to a process of producing a printed wiring board having first and second electrically conductive circuit layers provided on an insulating laminate. The insulating laminate includes a first insulating layer having metal foils provided on both sides thereof and a second insulating layer which is attached to one of the sides of the first insulating layer so as to place one of the electrically conductive circuit layers between the first and second insulating layers. The first electrically conductive circuit layer is formed in a predetermined pattern by printing and etching one of the metal foils. Then, connecting through-holes are formed in the first insulating layer across the first electrically conductive circuit layer and the remaining metal foil. The second insulating layer is attached onto the first insulating layer so that the first electrically conductive circuit layer is covered with the second insulating layer.