Patents by Inventor Zion Koren
Zion Koren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140246422Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.Type: ApplicationFiled: March 5, 2014Publication date: September 4, 2014Applicant: MATTSON TECHNOLOGY, INC.Inventors: ZION KOREN, CONNOR PATRICK O'CARROLL, SHUEN CHUN CHOY, PAUL JANIS TIMANS, RUDY SANTO TOMAS CARDEMA, JAMES TSUNEO TAOKA, ARIETH A. STROD
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Publication number: 20110222840Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.Type: ApplicationFiled: May 20, 2011Publication date: September 15, 2011Inventors: Zion Koren, Conor Patrick O' Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A. Strod
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Patent number: 7949237Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.Type: GrantFiled: September 11, 2007Date of Patent: May 24, 2011Assignee: Mattson Technology, Inc.Inventors: Zion Koren, Conor Patrick O'Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A. Strod
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Publication number: 20070297775Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.Type: ApplicationFiled: September 11, 2007Publication date: December 27, 2007Inventors: Zion Koren, Conor O'Carroll, Shuen Choy, Paul Timans, Rudy Santo Cardema, James Taoka, Arieh Strod
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Patent number: 7269343Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.Type: GrantFiled: May 19, 2005Date of Patent: September 11, 2007Assignee: Mattson Technology, Inc.Inventors: Zion Koren, Conor Patrick O'Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A. Strod
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Patent number: 6970644Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.Type: GrantFiled: December 21, 2000Date of Patent: November 29, 2005Assignee: Mattson Technology, Inc.Inventors: Zion Koren, Conor Patrick O'Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A. Strod
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Publication number: 20050213949Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.Type: ApplicationFiled: May 19, 2005Publication date: September 29, 2005Inventors: Zion Koren, Conor O'Carroll, Shuen Choy, Paul Timans, Rudy Cardema, James Taoka, Arieh Strod
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Patent number: 6770146Abstract: The present invention is generally directed to a system and process for rotating semiconductor wafers in thermal processing chambers, such as rapid thermal processing chambers and chemical vapor deposition chambers. In accordance with the present invention, a semiconductor wafer is supported on a substrate holder which, in turn, is supported on a rotor. During processing, the rotor is magnetically levitated and magnetically rotated by suspension actuators and rotation actuators positioned outside of the chamber.Type: GrantFiled: February 2, 2001Date of Patent: August 3, 2004Assignee: Mattson Technology, Inc.Inventors: Zion Koren, Yorkman Ma, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Lois Wride, Craig McFarland, Shawn Gibson
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Patent number: 6717158Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be either active sources of light energy or passive sources which reflect, refract or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.Type: GrantFiled: January 6, 2000Date of Patent: April 6, 2004Assignee: Mattson Technology, Inc.Inventors: Arnon Gat, Bob Bogart, Conor Patrick O'Carroll, Paul Janis Timans, Shuen Chun Choy, Zion Koren, Chris Francis Bragg
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Publication number: 20040018008Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.Type: ApplicationFiled: December 21, 2000Publication date: January 29, 2004Applicant: Mattson Technology, Inc.Inventors: Zion Koren, Conor Patrick O'Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardena, James Tsuneo Taoka, Arieh A. Strod
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Patent number: 6559424Abstract: An apparatus for heat treating semiconductor wafers in a thermal processing chamber using light energy is provided. In one embodiment, the apparatus contains a window located between the semiconductor wafer and the energy source. The window contains a member that defines at least one passage capable of being placed into communication with a coolant to cool the window and at least partially offset the “first wafer effect”. Additionally, in some embodiments, the window has a thickness greater than about 1 inch so that it can withstand pressures applied during wafer processing.Type: GrantFiled: January 2, 2001Date of Patent: May 6, 2003Assignee: Mattson Technology, Inc.Inventors: Conor Patrick O'Carroll, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Zion Koren
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Publication number: 20020104619Abstract: The present invention is generally directed to a system and process for rotating semiconductor wafers in thermal processing chambers, such as rapid thermal processing chambers and chemical vapor deposition chambers. In accordance with the present invention, a semiconductor wafer is supported on a substrate holder which, in turn, is supported on a rotor. During processing, the rotor is magnetically levitated and magnetically rotated by suspension actuators and rotation actuators positioned outside of the chamber.Type: ApplicationFiled: February 2, 2001Publication date: August 8, 2002Inventors: Zion Koren, Yorkman Ma, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Lois Wride, Craig McFarland, Shawn Gibson
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Publication number: 20020084424Abstract: An apparatus for heat treating semiconductor wafers in a thermal processing chamber using light energy is provided. In one embodiment, the apparatus contains a window located between the semiconductor wafer and the energy source. The window contains a member that defines at least one passage capable of being placed into communication with a coolant to cool the window and at least partially offset the “first wafer effect”. Additionally, in some embodiments, the window has a thickness greater than about 1 inch so that it can withstand pressures applied during wafer processing.Type: ApplicationFiled: January 2, 2001Publication date: July 4, 2002Inventors: Conor Patrick O'Carroll, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Zion Koren