Abstract: An integrated circuit device is formed to include a plurality of vias that connect an antenna to a ground reference. This configuration of the integrated circuit device provides an electrical path from the antenna to ground, thereby preventing the buildup of charge at the antenna. The vias thereby reduce the likelihood of a potential difference between components of the integrated circuit device and the antenna, in turn reducing the likelihood of electrostatic discharge at the integrated circuit device.

Abstract: An integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the electrically conductive material and a second side opposite to the first side, a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and arranged at a package side, and an integrated antenna structure arranged between the first electrically isolating layer and the second electrically isolating layer. The electrically conductive material is encapsulated by a dielectric material, arranged to partly overlap the integrated antenna structure, separated from the integrated antenna structure by at least the first electrically isolating layer and arranged to reflect a radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side.

Abstract: A packaged radio frequency, RF, circuit (500) is described that comprises: a printed circuit board, PCB, substrate comprising at least one electrically conductive transmission line on a top portion of the PCB substrate, wherein the PCB substrate comprises a plurality of vias (520) passing there through coupling the top portion of the PCB substrate to a ground plane; and an integrated circuit package located atop the PCB substrate in a vertical plane and electrically coupled to the PCB substrate via a plurality of ball grid arrays, BGAs (530), wherein a first BGA is configured to carry at least one RF signal (510) from the package to the PCB substrate, In the vertical plane, a first portion of the plurality of vias (520) are offset from an adjacent first portion of the plurality of BGAs (530) by a first distance, and a second portion of the plurality of vias (520) located around a substantial portion of the first BOA are offset from a respective adjacent second portion of the plurality of BGAs (530) by a secon

Abstract: An apparatus configured to provide for detection and ranging of a remote object, the apparatus configured to perform the following: based on a first reflected signal comprising a reflection from the remote object of a first frequency varying detection signal that varies in frequency over a first bandwidth; and based on a second reflected signal comprising a reflection from the remote object of a second frequency varying detection signal that varies in frequency over a different second bandwidth; determine a first estimated range based on a first beat frequency signal comprising the first reflected signal mixed with the first frequency varying detection signal; determine a second estimated range based on a second beat frequency signal comprising the second reflected signal mixed with the second frequency varying detection signal; determine a range of the remote object as a function of the first estimated range and the second estimated range.

Abstract: The disclosure relates to patch antennas for radar or communications applications. Example embodiments include an antenna comprising: a substrate; a ground plane on a first face of the substrate; and a patch antenna on an opposing second face of the substrate, the patch antenna having a lead extending along a central axis and connected to a rectangular radiating element, wherein the rectangular radiating element comprises two slots on opposing sides of the central axis such that the patch antenna has two resonant frequencies within an operating frequency range of the antenna.

Abstract: A method of tuning inductive and/or capacitive components within an integrated circuit device. The method comprises measuring bare-die mounted performance of such a component formed within a semiconductor die, determining a package distribution layer pattern for the at least one component for achieving a desired performance for the at least one component based at least partly on the measured bare-die mounted performance, and packaging the semiconductor die with the determined package distribution layer pattern for the at least one component.

Abstract: An integrated circuit package comprises a dielectric material, a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer arranged at a first side of the integrated circuit package, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and/or receiving a radio frequency signal arranged between the first and second electrically isolating layers. The electrically conductive material is separated from the integrated antenna structure by at least the dielectric material and the first electrically isolating layer, arranged to partly overlap the integrated antenna structure and to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer and the dielectric material to the first side.

Abstract: A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises: a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The hole extends beyond the first wall away from the second wall.

Abstract: An integrated circuit device is formed to include a plurality of vias that connect an antenna to a ground reference. This configuration of the integrated circuit device provides an electrical path from the antenna to ground, thereby preventing the buildup of charge at the antenna. The vias thereby reduce the likelihood of a potential difference between components of the integrated circuit device and the antenna, in turn reducing the likelihood of electrostatic discharge at the integrated circuit device.

Abstract: A radio frequency coupling structure is arranged to couple a radio frequency signal between a first side of the radio frequency coupling structure to a second side of the radio frequency coupling structure opposite to the first side. The radio frequency coupling structure comprises a dielectric layer, a first electrically conductive layer comprising a first transition structure, a second electrically conductive layer comprising a second transition structure, and an integrated waveguide structure formed by an array of electrically conductive vias extending through the dielectric layer from the first to the second electrically conductive layer to enclose a portion of the dielectric layer. The portion is arranged to guide the radio frequency signal between the first transition structure and the second transition structure.

Abstract: A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises first and second coupling structures. Each coupling structure has a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The first and second coupling structures are symmetrically arranged with the first electrically conductive layers closer to each other than the second electrically conductive layers are to each other.

Abstract: An integrated circuit package has a first side and an opposite second side. The integrated circuit package comprises: a stack of layers comprising at least a first and second electrically isolating layers, a dielectric material arranged on the stack of layers at the second side for encapsulating the integrated circuit package, a first integrated antenna structure for transmitting and/or receiving a first radio frequency signal, and a first array of electrically conductive vias extending through at least the first electrically isolating layer and the dielectric material. The first integrated antenna structure is arranged between the first and second electrically isolating layers and is surrounded by the electrically conductive vias which are electrically connected to respective first metal patches arranged on the dielectric material at the second side.

Abstract: An integrated circuit package has a first side and an opposite second side. The integrated circuit package comprises: a stack of layers comprising at least a first and second electrically isolating layers, a dielectric material arranged on the stack of layers at the second side for encapsulating the integrated circuit package, a first integrated antenna structure for transmitting and/or receiving a first radio frequency signal, and a first array of electrically conductive vias extending through at least the first electrically isolating layer and the dielectric material. The first integrated antenna structure is arranged between the first and second electrically isolating layers and is surrounded by the electrically conductive vias which are electrically connected to respective first metal patches arranged on the dielectric material at the second side.

Abstract: A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises: a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The hole extends beyond the first wall away from the second wall.

Abstract: An integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the electrically conductive material and a second side opposite to the first side, a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and arranged at a package side, and an integrated antenna structure arranged between the first electrically isolating layer and the second electrically isolating layer. The electrically conductive material is encapsulated by a dielectric material, arranged to partly overlap the integrated antenna structure, separated from the integrated antenna structure by at least the first electrically isolating layer and arranged to reflect a radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side.

Abstract: An integrated circuit package comprises a dielectric material, a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer arranged at a first side of the integrated circuit package, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and/or receiving a radio frequency signal arranged between the first and second electrically isolating layers. The electrically conductive material is separated from the integrated antenna structure by at least the dielectric material and the first electrically isolating layer, arranged to partly overlap the integrated antenna structure and to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer and the dielectric material to the first side.

Abstract: A radio frequency coupling structure is arranged to couple a radio frequency signal between a first side of the radio frequency coupling structure to a second side of the radio frequency coupling structure opposite to the first side. The radio frequency coupling structure comprises a dielectric layer, a first electrically conductive layer comprising a first transition structure, a second electrically conductive layer comprising a second transition structure, and an integrated waveguide structure formed by an array of electrically conductive vias extending through the dielectric layer from the first to the second electrically conductive layer to enclose a portion of the dielectric layer. The portion is arranged to guide the radio frequency signal between the first transition structure and the second transition structure.

Abstract: Embodiments relate to two-dimensional antenna arrays. In one embodiment, an antenna array includes single-ended fed patch antennas and differentially fed patches. Field polarization of the radiated and/or received EM waves is different by 90 degrees for each different antenna type. Thus, an aligned polarization pattern can be achieved using orthogonal feeding direction for single-ended and differential patches. Embodiments can be used in radar or virtually any other 2D array antenna system.

Abstract: Embodiments relate to two-dimensional antenna arrays. In one embodiment, an antenna array includes single-ended fed patch antennas and differentially fed patches. Field polarization of the radiated and/or received EM waves is different by 90 degrees for each different antenna type. Thus, an aligned polarization pattern can be achieved using orthogonal feeding direction for single-ended and differential patches. Embodiments can be used in radar or virtually any other 2D array antenna system.