Patents by Inventor Zirui WU

Zirui WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250070178
    Abstract: This application relates to a binder, an electrode plate, a secondary battery, and an electric apparatus. A modified polyacrylic acid polymer material has the following structural features. The foregoing modified polyacrylic acid polymer material employs polymerization of four monomers: an acrylic acid, an alkaline metal salt of acrylic acid, a polyethylene glycol acrylate monoester, and acrylonitrile, and is capable of acting as a binder, fully coating the active material in the process of mixing with the active material, lowering the rebound of the electrode plate under extreme design conditions, reducing the cell expansion force during cycling, and increasing the cell life.
    Type: Application
    Filed: November 13, 2024
    Publication date: February 27, 2025
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
    Inventors: Zhipeng DAI, Miaomiao REN, Chao JIN, Zirui WU, Guanfusheng YAN
  • Publication number: 20240204204
    Abstract: The present application provides a current collector, electrode plate, cell, battery, device, manufacturing method, and apparatus. The current collector includes a conductive layer and a support layer, wherein the conducive layer is provided on a surface of the support layer, and the support layer includes an insulating base and a support structure embedded in the insulating base to enhance strength of the support layer, which not only increases an overall strength of the current collector and can improve the problem of tape breakage during processing, but also allows strength of the support layer to be close to strength of the conductive layer, narrowing the gap in structural strength between the support layer and the conductive layer, and reducing the difference in deformation between the conductive layer and the support layer during processing, so that it is conducive to improving processing performance of the current collector.
    Type: Application
    Filed: March 1, 2024
    Publication date: June 20, 2024
    Inventors: Lianhua LI, Xianwei YANG, Yang LU, Shaowei QI, Chen QI, Zirui WU, Chao JIN, Miaomiao REN, Yonghuang YE