Abstract: A light-emitting device includes a light-emitting assembly and a light-transmissive component. The light-emitting assembly includes a first bracket, a light-emitting element, and a first photosensitive element. The first bracket has a first surface and a second surface opposite to each other. Multiple first electrodes and multiple second electrodes are disposed at intervals on the first surface, and the light-emitting element and the first photosensitive element are disposed at intervals on the second surface. The light-emitting element is electrically connected to at least one of the multiple first electrodes. The first photosensitive element is electrically connected to at least one of the multiple second electrodes.

Abstract: An ultraviolet LED device includes a holder and a lens. The holder is provided with an accommodation cavity. The lens is configured to seal the accommodation cavity. A chip is disposed at a cavity bottom of the accommodation cavity. The accommodation cavity is filled with a Si—O main chain polymer. The holder is provided with at least one through hole. The at least one through hole is located at the bottom of the holder and communicates with the accommodation cavity. A sealing member is disposed in each of the at least one through hole.

Abstract: Provided are a method for machining a device and the device. The method for machining a device includes die bonding, primary dicing, filling by a baffle wall material, grinding and secondary dicing. In the step of grinding machining, a semi-finished product is placed on a platform surface of a grinding and fixing platform, a grinding working end of a grinding device is controlled to operate, and with the platform surface of the grinding and fixing platform as a height reference, the grinding working end grinds from above the semi-finished product toward the grinding and fixing platform and operates to a preset height. Through the special machining process, the probability of the appearance of white glue on a top surface of the device is reduced, which is conducive to ensuring a production yield of the device.