Abstract: Aspects of the embodiments are directed to an optoelectronic device that includes one or more pressure sensitive adhesives to secure components during an assembly process. The optoelectronic device includes an electromagnetic interference/radio frequency interference shield. The shield can include an aperture for permitting light to enter a photodetector. An infrared filter can be secured to the shield using a pressure sensitive adhesive (PSA) film. The PSA film can be a templated film that is double sided. A PSA film can also be used to secure the shield to the printed circuit board (PCB) of the optoelectronic device. To promote electromagnetic conduction between the shield and the PCB, the PSA film can include additives. Aspects of the embodiments are directed to methods for assembling the optoelectronic device by picking and placing a PSA film and applying a pressure to certain components to activate the PSA film adhesion.

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Abstract: A photo-curable ink composition including an acrylic polymer or copolymer, a vinyl ester component, a multifunctional monomer, a photoinitiator and a pigment. Also disclosed herein is a method for forming a printed article and an ink-jet ink printing system using said photo-curable ink composition.

Abstract: A mill base composition includes a compound comprising a divinyl ester of a dicarboxylic acid, a dispersing agent, and a pigment. The divinyl ester of the carboxylic acid includes from 2 to about 8 carbon atoms. The mill base composition is subjected to milling with milling beads to produce a milled mill base composition that functions as a pigment concentrate that may be added to an ink vehicle to form an ink composition suitable for use in inkjet ink devices. The milled mill base composition is particularly suited for UV curable ink compositions. A UV curable ink composition includes the pigment concentrate, one or more UV curable monomers, and one or more UV initiators.

Abstract: A mill base composition includes a compound comprising a divinyl ester of a dicarboxylic acid, a dispersing agent, and a pigment. The divinyl ester of the carboxylic acid includes from 2 to about 8 carbon atoms. The mill base composition is subjected to milling with milling beads to produce a milled mill base composition that functions as a pigment concentrate that may be added to an ink vehicle to form an ink composition suitable for use in inkjet ink devices. The milled mill base composition is particularly suited for UV curable ink compositions. A UV curable ink composition includes the pigment concentrate, one or more UV curable monomers, and one or more UV initiators.

Abstract: A mill base composition includes a compound comprising a divinyl ester of a dicarboxylic acid, a dispersing agent, and a pigment. The divinyl ester of the carboxylic acid includes from 2 to about 8 carbon atoms. The mill base composition is subjected to milling with milling beads to produce a milled mill base composition that functions as a pigment concentrate that may be added to an ink vehicle to form an ink composition suitable for use in inkjet ink devices. The milled mill base composition is particularly suited for UV curable ink compositions. A UV curable ink composition includes the pigment concentrate, one or more UV curable monomers, and one or more UV initiators.

Abstract: A mill base composition includes a compound comprising a divinyl ester of a dicarboxylic acid, a dispersing agent, and a pigment. The divinyl ester of the carboxylic acid includes from 2 to about 8 carbon atoms. The mill base composition is subjected to milling with milling beads to produce a milled mill base composition that functions as a pigment concentrate that may be added to an ink vehicle to form an ink composition suitable for use in inkjet ink devices. The milled mill base composition is particularly suited for UV curable ink compositions. A UV curable ink composition includes the pigment concentrate, one or more UV curable monomers, and one or more UV initiators.

Abstract: A photo-curable ink composition including an acrylic polymer or copolymer, a vinyl ester component, a multifunctional monomer, a photoinitiator and a pigment. Also disclosed herein is a method for forming a printed article and an ink-jet ink printing system using said photo-curable ink composition.

Abstract: A mill base composition includes a compound comprising a divinyl ester of a dicarboxylic acid, a dispersing agent, and a pigment. The divinyl ester of the carboxylic acid includes from 2 to about 8 carbon atoms. The mill base composition is subjected to milling with milling beads to produce a milled mill base composition that functions as a pigment concentrate that may be added to an ink vehicle to form an ink composition suitable for use in inkjet ink devices. The milled mill base composition is particularly suited for UV curable ink compositions. A UV curable ink composition includes the pigment concentrate, one or more UV curable monomers, and one or more UV initiators.