Abstract: Two or more power converters are connected in parallel to supply power current to a joining node through connecting resistors. An output voltage before the connecting resistor in each power converter is sampled and divided by a sampling ratio to generate sampled voltages for each power converter. A current sharing circuit for each power converter receives the local sampled voltage and another sampled voltage from another power converter. The current sharing circuit generates an adjustment voltage that is injected into a feedback loop. The adjustment voltage modifies the output voltage of the power converter, adjusting and balancing the power current delivered by that power converter. Power currents from several power converters are reduced and balanced when the same sampling ratio is used for all power converters. Current hogging by one power converter is prevented.

Abstract: Two or more power converters are connected in parallel to supply power current to a joining node through connecting resistors. An output voltage before the connecting resistor in each power converter is sampled and divided by a sampling ratio to generate sampled voltages for each power converter. A current sharing circuit for each power converter receives the local sampled voltage and another sampled voltage from another power converter. The current sharing circuit generates an adjustment voltage that is injected into a feedback loop. The adjustment voltage modifies the output voltage of the power converter, adjusting and balancing the power current delivered by that power converter. Power currents from several power converters are reduced and balanced when the same sampling ratio is used for all power converters. Current hogging by one power converter is prevented.

Abstract: A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.

Abstract: A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.

Abstract: The present invention discloses a fluid cooling assembly which facilitates turbulent flow inside the assembly so as to achieve better heat dissipating effect. The cooling assembly comprises an enclosed chamber with an inlet and an outlet for fluid to pass through; together with a heat spreader; a plurality of micropillars and a plurality of heat dissipating fins installed inside the assembly. When fluid flows through the chamber, these elements in combination are adapted to create an enhanced turbulent flow upon the fluid so as to effectively dissipate heat from said heat spreader through the fluid.

Abstract: A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.

Abstract: The present invention discloses a fluid cooling assembly which facilitates turbulent flow inside the assembly so as to achieve better heat dissipating effect. The cooling assembly comprises an enclosed chamber with an inlet and an outlet for fluid to pass through; together with a heat spreader; a plurality of micropillars and a plurality of heat dissipating fins installed inside the assembly. When fluid flows through the chamber, these elements in combination are adapted to create an enhanced turbulent flow upon the fluid so as to effectively dissipate heat from said heat spreader through the fluid.

Abstract: A system for bonding a die to a high power dielectric carrier such as a ceramic dielectric core with double-sided conductive layers is described. In the system, the upper conductive layer has a first area whose surface has a first wettability. A second area that at least partially surrounds the first area has a surface with a second wettability that is greater than the first wettability. During bonding, an adhesive material bonding a chip to the substrate spreads among the first area by a downward force placed on the chip. Due to the difference in wettability, the adhesive material then spreads among the second area by a wetting force generated by the greater second wettability of the second area surface causing the chip to be drawn down until reaching a predetermined position. The predetermined position can be determined by substrate protrusions or substrate cavities.

Abstract: A system for bonding a die to a high power dielectric carrier such as a ceramic dielectric core with double-sided conductive layers is described. In the system, the upper conductive layer has a first area whose surface has a first wettability. A second area that at least partially surrounds the first area has a surface with a second wettability that is greater than the first wettability. During bonding, an adhesive material bonding a chip to the substrate spreads among the first area by a downward force placed on the chip. Due to the difference in wettability, the adhesive material then spreads among the second area by a wetting force generated by the greater second wettability of the second area surface causing the chip to be drawn down until reaching a predetermined position. The predetermined position can be determined by substrate protrusions or substrate cavities.

Abstract: A tire pressure monitoring sensor moveable inside a tire includes a housing holding a pressure sensing/transmitting unit, one or more batteries and an antenna for transmitting a signal indicating interior tire pressure. In one embodiment, the components are assembled within the housing such that the center of gravity is along a housing geometric center. During tire rotation, the monitor independently rotates within the tire and is particularly useful for slow-rotating tires, such as those used in gantry systems. Alternatively, the pressure monitoring sensor components are assembled within the housing such that the center of gravity is offset from a housing geometric center. Centripetal force generated during tire rotation causes the monitor to rotate with the tire itself and is useful for faster-rotating tires, such as motor vehicle tires. A tire pressure monitoring system includes the monitor and a receiver positioned outside the tire for receiving the monitoring signals.

Abstract: A tire pressure monitoring sensor moveable inside a tire includes a housing holding a pressure sensing/transmitting unit, one or more batteries and an antenna for transmitting a signal indicating interior tire pressure. In one embodiment, the components are assembled within the housing such that the center of gravity is along a housing geometric center. During tire rotation, the monitor independently rotates within the tire and is particularly useful for slow-rotating tires, such as those used in gantry systems. Alternatively, the pressure monitoring sensor components are assembled within the housing such that the center of gravity is offset from a housing geometric center. Centripetal force generated during tire rotation causes the monitor to rotate with the tire itself and is useful for faster-rotating tires, such as motor vehicle tires. A tire pressure monitoring system includes the monitor and a receiver positioned outside the tire for receiving the monitoring signals.

Abstract: A self-powered impulse detecting system comprising a signal transmitter; an energy storage component; and an energy harvester comprising a top plate configured to receive a stress impulse by an external object on its top surface; a bottom plate positioned opposite to the top plate and leaving room in between the bottom plate and the top plate; an elastic element positioned in between the top plate and the bottom plate; a bendable substrate attached at a first end to the bottom surface of the top plate, the bendable substrate is configured to bend freely, colliding with the top plate and a stopper; a piezoelectric element positioned on the bendable substrate; a deadweight attached to a second end of the bendable substrate; wherein collisions between the bendable substrate, the top plate and the stopper cause the bendable substrate to bend along with the piezoelectric element to generate power.

Abstract: Subject matter disclosed herein may relate to energy harvesting piezoelectric modules as may be used, for example, in power supplies for tire pressure monitoring systems.

Abstract: A self-powered impulse detecting system comprising a signal transmitter; an energy storage component; and an energy harvester comprising a top plate configured to receive a stress impulse by an external object on its top surface; a bottom plate positioned opposite to the top plate and leaving room in between the bottom plate and the top plate; an elastic element positioned in between the top plate and the bottom plate; a bendable substrate attached at a first end to the bottom surface of the top plate, the bendable substrate is configured to bend freely, colliding with the top plate and a stopper; a piezoelectric element positioned on the bendable substrate; a deadweight attached to a second end of the bendable substrate; wherein collisions between the bendable substrate, the top plate and the stopper cause the bendable substrate to bend along with the piezoelectric element to generate power.

Abstract: Disclosed is an energy harvesting device which can produce electrical power from vibrational energy over a wide range of frequencies. The energy harvester includes a housing having opposing slots. A bendable substrate is at least partially positioned within the housing and at least partially extends through the opposing housing slots. A piezoelectric element is positioned on the bendable substrate and a weight cooperates with the bendable substrate. A stopper is positioned on each end of the bendable substrate that extends outside the housing; the stoppers are configured to maintain a portion of the bendable substrate within the housing such that the bendable substrate is freely movable within the housing. Vibrational energy causes collisions between the bendable substrate and the housing such that the forces on the piezoelectric element generate power.

Abstract: An apparatus and method for generating electricity using piezoelectric material. The apparatus comprises a first elongate member and a second elongate member that are joining together at first and second points which are spaced apart from each other. The second elongate member comprises a piezoelectric element, or has a piezoelectric element mounted thereon. When pressure is applied to the first elongate member, the second elongate member is stretched and the stretching force is applied to the piezoelectric element. This generates electricity. A similar arrangement with a third elongate member may be provided on the other side of the second elongate member. The apparatus may be placed in a shoe or underneath a floor, so that the variation in pressure caused by walking may be used in generate electricity.

Abstract: An apparatus and method for generating electricity using piezoelectric material. The apparatus comprises a first elongate member and a second elongate member that are joining together at first and second points which are spaced apart from each other. The second elongate member comprises a piezoelectric element, or has a piezoelectric element mounted thereon. When pressure is applied to the first elongate member, the second elongate member is stretched and the stretching force is applied to the piezoelectric element. This generates electricity. A similar arrangement with a third elongate member may be provided on the other side of the second elongate member. The apparatus may be placed in a shoe or underneath a floor, so that the variation in pressure caused by walking may be used in generate electricity.

Abstract: A method of determining the location information of a plurality of wheels mounted on a vehicle by obtaining a relationship between the lateral location of a wheel and the polarity of a transverse acceleration transmitted by an accelerometer of a wheel in response to a lateral turn of the vehicle in a direction of a lateral side of the vehicle and determining the lateral location of a wheel with reference to the polarity of the transverse acceleration signal transmitted by the accelerometer of the wheel upon the vehicle undergoing a lateral turn.

Abstract: Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems.

Abstract: Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems.