Patents by Inventor Zi-yi Yang

Zi-yi Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149436
    Abstract: A method for manufacturing an interconnect structure includes: forming sacrificial portions and electrically conductive portions on a base structure such that the sacrificial portions are disposed to alternate with the electrically conductive portions in a first direction, and such that each of the sacrificial portions and the electrically conductive portions is elongated in a second direction transverse to the first direction; forming blocking portions respectively on the sacrificial portions; forming a sacrificial layer to cover the electrically conductive portions and the blocking portions; forming an electrically conductive via which extends through the sacrificial layer so as to permit the electrically conductive via to be electrically connected to one of the electrically conductive portions; after forming the electrically conductive via, performing a removal process to remove the sacrificial layer, the blocking portions and the sacrificial portions so as to form a cavity; and forming a dielectric portio
    Type: Application
    Filed: November 6, 2023
    Publication date: May 8, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Gary LIU, Ting-Ya LO, Shao-Kuan LEE, Zi-Yi YANG, Chi-Lin TENG, Kuang-Wei YANG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Ming-Han LEE, Shau-Lin SHUE
  • Publication number: 20240234203
    Abstract: A method for manufacturing a semiconductor device includes: preparing a conductive structure that includes a plurality of conductive features, adjacent two of which are spaced apart from each other by a corresponding one of a plurality of recesses; conformally forming a dielectric capping layer on the conductive structure; forming a dielectric cover layer on the dielectric capping layer to fill the recesses; and removing a portion of the dielectric cover layer and a portion of the dielectric capping layer to expose the conductive features, so as to form a plurality of spacer features respectively filled in the recesses; wherein each of the dielectric capping layer and the dielectric cover layer is made of a dielectric material doped with metal oxide.
    Type: Application
    Filed: January 5, 2023
    Publication date: July 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ting-Ya LO, Shao-Kuan LEE, GARY LIU, Zi-Yi YANG, Kuang-Wei YANG, Jing-Ting SU, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
  • Publication number: 20230279367
    Abstract: The present disclosure provides a method for increasing production of an indigoid compound, including the following steps: (a) mutating a wild-type flavin-containing monooxygenase to a mutant flavin-containing monooxygenase expressed in Escherichia coli; and (b) culturing the Escherichia coli in a bacterial culture medium comprising tryptophan to allow the mutant FMO to interact with tryptophan for a predetermined time to convert the tryptophan into the indigoid compound. Compared to the wild-type flavin-containing monooxygenase, the mutant flavin-containing monooxygenase increases production of the indigoid compound. The present disclosure also provides a recombinant polypeptide for increasing production of the indigoid compound.
    Type: Application
    Filed: December 7, 2022
    Publication date: September 7, 2023
    Inventors: Roa-Pu Claire Shen, Zi-Yi Yang, Vincent Ruan, Pi-Ju Yang
  • Publication number: 20170329925
    Abstract: A system and a method for determining an estimated survival time of a subject with a medical condition utilizes the novel RS-AFT model and is especially suitable and highly advantageous for survival analysis based on microarray gene expression data because of its exceptional performance of gene selection, stable noise resistance, and high prediction precision.
    Type: Application
    Filed: May 10, 2016
    Publication date: November 16, 2017
    Inventors: Yong Liang, Hua Chai, Zi-yi Yang, Xiao-Ying Liu