Patents by Inventor Znewa Zeng

Znewa Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170339788
    Abstract: A printed circuit board has multiple stacked layers laminated together. A through hole is formed through the laminated stack, and plating is applied to the side walls of the though hole, thereby forming a plated through hole. Second through holes are then formed through the laminated stack, where each second through hole overlaps an edge of the plated through hole. By aligning the second through holes at the edge of the plated through hole, the plating of the plated through hole coincident with each second through hole is removed, thereby separating the plated through hole into two separate circuit paths. Forming second through holes in this manner effectively splits the circuit path of the plated through hole into multiple separate circuit paths, which increases the circuit density of the printed circuit board.
    Type: Application
    Filed: June 7, 2016
    Publication date: November 23, 2017
    Applicant: Multek Technologies Limited
    Inventors: Znewa Zeng, Pui Yin Yu