Patents by Inventor Zoi Karipidou

Zoi Karipidou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid semiconductor electronic device having multiple material layers
    Patent number: 8455864
    Abstract: Method of manufacture of an electronic device, comprising providing a substrate comprising a semiconductor device stack, depositing a first material layer over the substrate, the first material layer being an insulating layer, depositing an active organic material layer over the first material layer, depositing a second material layer over the active organic material layer, the second material layer being an insulating layer.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: June 4, 2013
    Assignee: Sony Corporation
    Inventors: Rene Wirtz, Silvia Rosselli, Gabriele Nelles, Nikolaus Knorr, Zoi Karipidou, Ameneh Bamedi Zilai
  • Method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate
    Patent number: 8236670
    Abstract: A method of applying a pattern of metal, metal oxide, and/or semiconductor material on a substrate, a pattern created by that method, and uses of that pattern.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: August 7, 2012
    Assignees: Sony Deutschland GmbH, Forschungszentrum Juelich GmbH
    Inventors: Jurina Wessels, Akio Yasuda, Zoi Karipidou, Akos Schreiber, Marc Riedel, Daniel Schwaab, Dirk Mayer, Andreas Offenhaeusser
  • Method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate
    Patent number: 8177991
    Abstract: The present application relates to a method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate, to a pattern created by such method and to uses of such pattern. Furthermore, the present invention relates to an assembly of layers that can be used for printing.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: May 15, 2012
    Assignee: Sony Corporation
    Inventors: Björn Lüssem, Zoi Karipidou, Jurina Wessels, Akio Yasuda
  • METHOD OF APPLYING A PATTERN OF METAL, METAL OXIDE AND/OR SEMICONDUCTOR MATERIAL ON A SUBSTRATE
    Publication number: 20110180906
    Abstract: A method of applying a pattern of metal, metal oxide, and/or semiconductor material on a substrate, a pattern created by that method, and uses of that pattern.
    Type: Application
    Filed: March 26, 2007
    Publication date: July 28, 2011
    Applicants: Sony Deutschland GmbH, FORSCHUNGSZENTRUM JUELICH GMBH
    Inventors: Jurina Wessels, Akio Yasuda, Zoi Karipidou, Akos Schreiber, Marc Riedel, Daniel Schwaab, Dirk Mayer, Andreas Offenhaeusser
  • ELECTRONIC HYBRID DEVICE
    Publication number: 20110108816
    Abstract: Method of manufacture of an electronic device, comprising providing a substrate comprising a semiconductor device stack, depositing a first material layer over the substrate, the first material layer being an insulating layer, depositing an active organic material layer over the first material layer, depositing a second material layer over the active organic material layer, the second material layer being an insulating layer.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 12, 2011
    Applicant: SONY CORPORATION
    Inventors: Rene Wirtz, Silvia Rosselli, Gabriele Nelles, Nikolaus Knorr, Zoi Karipidou, Ameneh Bamedi Zilai
  • METHOD OF APPLYING A PATTERN OF METAL, METAL OXIDE AND/OR SEMICONDUCTOR MATERIAL ON A SUBSTRATE
    Publication number: 20090214838
    Abstract: The present application relates to a method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate, to a pattern created by such method and to uses of such pattern. Furthermore, the present invention relates to an assembly of layers that can be used for printing.
    Type: Application
    Filed: December 22, 2008
    Publication date: August 27, 2009
    Applicant: Sony Corporation
    Inventors: Bjorn Lussem, Zoi Karipidou, Jurina Wessels, Akio Yasuda