Abstract: An integrated wafer debonding and cleaning apparatus and a debonding and cleaning method are provided. The integrated wafer debonding and cleaning apparatus includes an input port, a debonding module, a wafer cleaning device, and a transport device. The input port is configured to allow a substrate to be processed to enter the integrated wafer debonding and cleaning apparatus. The substrate to be processed includes a wafer and a carrier which are bonded. The debonding module is configured to debond the substrate to be processed, and to separate the wafer from the carrier. The wafer cleaning apparatus is configured to clean the wafer. The transport device is configured to transfer the substrate to be processed, the wafer, and the carrier. The debonding module and the wafer cleaning module are integrated in one apparatus for continuous processing.

Abstract: A cleaning apparatus and a method for removing residue from a chip-stacked structure are provided. The cleaning apparatus includes: a platform for placing thereon the chip-stacked structure and a two-fluid nozzle movable relative to the platform to reach a position in alignment with an interval between two adjacent chips, where the two-fluid nozzle is configured to apply a gas-liquid mixture including a chemical liquid and a gas to the chip-stacked structure. The chemical liquid of the gas-liquid mixture separates the residue in a gap from a its attached surface, and an impact force exerted by the gas of the gas-liquid mixture causes the residue to be carried out of the gap.

Abstract: A cleaning apparatus for removing residues from a chip stacked structure includes a platform on which the chip stacked structure is placed. A liquid supply device is for applying a cleaning liquid to the chip stacked structure to flow into a gap between chips and a substrate from a first side of the gap. A liquid suction device has a flexible skirt for engaging with the chips and is for providing a negative pressure to extract the cleaning liquid located in the gap through a second side of the gap, thereby bringing out the residues. A precise driving device is connected with the liquid suction device and has a vertical lifting mechanism for controlling the liquid suction device to move along a vertical direction, and a horizontal moving mechanism for controlling the liquid suction device to move along a horizontal direction.