Patents by Inventor Zong-Fu Li
Zong-Fu Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12381299Abstract: A power distribution component includes a wavelength converter, a connecting portion, a first power distribution portion and a second power distribution portion. The wavelength converter has an input end and a connection end. The connecting portion includes a first connecting end and a second connecting end, and the first connecting end is connected to the connection end. The first power distribution portion includes a first output port and a first end, and the first end is connected to the second connecting end. The second power distribution portion includes a second output port and a second end, and the second end is connected to the second connecting end. The first power distribution portion and the second power distribution portion are symmetrically disposed on opposite sides of the connecting portion by regarding the connecting portion as a mirror axis. Additionally, a wireless transceiver including a power distribution component is also provided.Type: GrantFiled: August 16, 2022Date of Patent: August 5, 2025Assignee: Merry Electronics Co., Ltd.Inventors: Tien-Fu Hung, Zong-Fu Li, Ming-Hung Tsai
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Publication number: 20240022050Abstract: A power distribution component includes a wavelength converter, a connecting portion, a first power distribution portion and a second power distribution portion. The wavelength converter has an input end and a connection end. The connecting portion includes a first connecting end and a second connecting end, and the first connecting end is connected to the connection end. The first power distribution portion includes a first output port and a first end, and the first end is connected to the second connecting end. The second power distribution portion includes a second output port and a second end, and the second end is connected to the second connecting end. The first power distribution portion and the second power distribution portion are symmetrically disposed on opposite sides of the connecting portion by regarding the connecting portion as a mirror axis. Additionally, a wireless transceiver including a power distribution component is also provided.Type: ApplicationFiled: August 16, 2022Publication date: January 18, 2024Applicant: Merry Electronics Co., Ltd.Inventors: Tien-Fu Hung, Zong-Fu Li, Ming-Hung Tsai
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Publication number: 20080116589Abstract: An integrated voltage regulator may be provided on the bottom of a ball grid array processor package. This may be done despite the fact that conventionally integrated voltage regulator chips are too thick to fit in the area normally available between the motherboard and the ball grid array package because that area is defined by solder balls of a necessarily limited height which is conventionally believed to be too small to accommodate the integrated voltage regulator.Type: ApplicationFiled: November 17, 2006Publication date: May 22, 2008Inventors: Zong-Fu Li, David England, Bobby Nikjou, Joseph T. Dibene, Hong Xie, Jason Zhang
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Patent number: 7223631Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.Type: GrantFiled: February 22, 2006Date of Patent: May 29, 2007Assignee: Intel CorporationInventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
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Publication number: 20060141674Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.Type: ApplicationFiled: February 22, 2006Publication date: June 29, 2006Inventors: Zong-Fu Li, Kabul Sengupta, Deborah Thompson
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Patent number: 7026707Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.Type: GrantFiled: February 11, 2004Date of Patent: April 11, 2006Assignee: Intel CorporationInventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
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Publication number: 20040159902Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.Type: ApplicationFiled: February 11, 2004Publication date: August 19, 2004Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
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Patent number: 6771314Abstract: A color imaging device comprised of a plurality of light selective elements. The light selective elements include a first light selective element selective to light having a wavelength corresponding to the Orange region of the spectrum, a second light selective element selective to light having a wavelength corresponding to the Green region of the spectrum, and a third light selective element sensitive to light having a wavelength corresponding to the Blue region of the spectrum.Type: GrantFiled: March 31, 1998Date of Patent: August 3, 2004Assignee: Intel CorporationInventors: Edward J. Bawolek, Zong-Fu Li
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Patent number: 6692993Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.Type: GrantFiled: April 10, 2000Date of Patent: February 17, 2004Assignee: Intel CorporationInventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
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Patent number: 6646808Abstract: By forming a microlens of negative photoresist, economical microlens fabrication processes may be used which, in some embodiments, may achieve microlenses having good optical clarity and high thermal stability. In one embodiment, a positive photoresist may be used as a pattern mask to transfer a pattern to the negative photoresist. The microlenses may be formed by dry etching the positive photoresist which acts as a mask to transfer a pattern to the underlying negative photoresist. At the same time a scratch protection layer may be formed over regions not overlying optical sensors.Type: GrantFiled: October 31, 2002Date of Patent: November 11, 2003Assignee: Intel CorporationInventor: Zong-Fu Li
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Patent number: 6623666Abstract: An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.Type: GrantFiled: September 13, 2000Date of Patent: September 23, 2003Assignee: Intel CorporationInventors: Edward J. Bawolek, Kabul Sengupta, Zong-Fu Li
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Patent number: 6587147Abstract: A method of forming a microlens including, in one aspect, depositing a substantially non-photo-imageable microlens material over an area of a chip, a portion of which contains an array of photosensitive circuits, and patterning the microlens material over the array of photosensitive circuits to define a microlens over each photosensitive circuit.Type: GrantFiled: August 22, 2000Date of Patent: July 1, 2003Assignee: Intel CorporationInventor: Zong-Fu Li
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Patent number: 6573503Abstract: An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.Type: GrantFiled: September 13, 2000Date of Patent: June 3, 2003Assignee: Intel CorporationInventors: Edward J. Bawolek, Kabul Sengupta, Zong-Fu Li
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Publication number: 20030054295Abstract: By forming a microlens of negative photoresist, economical microlens fabrication processes may be used which, in some embodiments, may achieve microlenses having good optical clarity and high thermal stability. In one embodiment, a positive photoresist may be used as a pattern mask to transfer a pattern to the negative photoresist. The microlenses may be formed by dry etching the positive photoresist which acts as a mask to transfer a pattern to the underlying negative photoresist. At the same time a scratch protection layer may be formed over regions not overlying optical sensors.Type: ApplicationFiled: October 31, 2002Publication date: March 20, 2003Inventor: Zong-Fu Li
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Patent number: 6525944Abstract: An apparatus and method for enabling interaction between electronic circuitry and optical signals with a package for enclosing the electronic circuitry having contacts and a window for the passage of optical signals disposed about a face of the package that becomes substantially inaccessible when the package is used.Type: GrantFiled: September 29, 2000Date of Patent: February 25, 2003Assignee: Intel CorporationInventor: Zong-Fu Li
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Publication number: 20020176037Abstract: The making and use of color microlenses in color image sensors and color display devices is described and claimed. The color microlenses combine the function of a colorless microlens and a color filter into a single structure simplifying the fabrication of, and increasing the reliability of display devices and image sensors using the described color microlenses.Type: ApplicationFiled: June 27, 2002Publication date: November 28, 2002Inventor: Zong-Fu Li
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Publication number: 20020125552Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.Type: ApplicationFiled: April 10, 2000Publication date: September 12, 2002Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
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Patent number: 6433844Abstract: The making and use of color microlenses in color image sensors and color display devices is described and claimed. The color microlenses combine the function of a colorless microlens and a color filter into a single structure simplifying the fabrication of, and increasing the reliability of display devices and image sensors using the described color microlenses.Type: GrantFiled: July 9, 2001Date of Patent: August 13, 2002Assignee: Intel CorporationInventor: Zong-Fu Li
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Patent number: 6424392Abstract: A liquid crystal color filter may include an infrared blocking. dye integrated within the filter to prevent infrared radiation from adversely affecting the performance of the filter when used in an imaging system. The dye may be incorporated into a liquid crystal element in the filter or may be coated on components thereof. Suitable dyes are transmissive of light in the visible range and substantially absorbent of light in the infrared range from approximately 800 nm to 1200 nm in wavelength.Type: GrantFiled: November 8, 2000Date of Patent: July 23, 2002Assignee: Intel CorporationInventors: Edward J. Bawolek, Gregory W. Starr, Zong-Fu Li
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Patent number: 6410359Abstract: Leakage current may be reduced in trench isolated semiconductor devices by providing a buffer between the trench isolation and an active area. For example, with a trench isolated photodiode, a buffer of opposite conductivity type may be provided between the trench and the diffusion that forms the p-n junction of the photodiode.Type: GrantFiled: March 26, 2001Date of Patent: June 25, 2002Assignee: Intel CorporationInventors: Kevin M. Connolly, Jung S. Kang, Berni W. Landau, James E. Breisch, Akira Kakizawa, Joseph W. Parks, Jr., Mark A. Beiley, Zong-Fu Li, Cory E. Weber, Shaofeng Yu